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參數(shù)資料
| 型號(hào)： | TDA1308T-T |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 0.04 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8 |
| 封裝： | 3.90 MM, PLASTIC, MS-012, SOT-96-1, SOP-8 |
| 文件頁(yè)數(shù)： | 4/17頁(yè) |
| 文件大?。?/td> | 576K |
| 代理商： | TDA1308T-T |
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TDA1308
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 14 March 2011
12 of 17
NXP Semiconductors
TDA1308
Class-AB stereo headphone driver
14.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 13) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 7 and 8
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 13.
Table 7.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 8.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TDA1308TT/N1,118 | 功能描述:音頻放大器 STEREO HEADPHONE DRIVER-TSSOP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TDA1308TT/N2 | 制造商:NXP Semiconductors 功能描述:AMP AUDIO .08W STER AB 8TSSOP 制造商:NXP Semiconductors 功能描述:AMP, AUDIO, .08W, STER, AB, 8TSSOP |
| TDA1308TT/N2,118 | 功能描述:音頻放大器 STEREO HDPHON DRVR RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TDA1308TT/N2118 | 制造商:NXP Semiconductors 功能描述:IC AUDIO AMP AB 40mW TSSOP-8 |
| TDA1308TT/N2-T | 功能描述:音頻放大器 STEREO HDPHON DRVR CLASS AB RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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