
2005 Microchip Technology Inc.
DS21661D-page 9
TCM809/TCM810
3-Lead Plastic Small Outline Transistor (LB) (SC-70)
12°
8°
12°
8°
b
Mold Draft Angle Bottom
12°
8°
12°
8°
a
Mold Draft Angle Top
0.40
0.15
.016
.006
B
Lead Width
0.25
0.08
.010
.003
c
Lead Thickness
0.41
0.10
.016
.004
L
Foot Length
2.25
1.80
.089
.071
D
Overall Length
1.35
1.15
.053
.045
E1
Molded Package Width
2.40
1.80
.094
.071
E
Overall Width
.010
0.00
.0004
.000
A1
Standoff
1.00
0.80
.039
.031
A2
Molded Package Thickness
1.10
0.80
.043
.031
A
Overall Height
1.30 BSC.
p1
Outside lead pitch (basic)
0.65 BSC.
p
Pitch
3
3
Number of Pins
MAX
MIN
MAX
MIN
Dimension Limits
MILLIMETERS*
INCHES
Units
shall not exceed .005" (0.127mm) per side.
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
Notes:
JEITA (EIAJ) Equivalent: SC70
Drawing No. C04-104
*Controlling Parameter
L
B
E1
E
p
c
p1
D
1
2
3
b
a
A
A2
A1
.026 BSC.
.051 BSC.