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參數(shù)資料
| 型號(hào)： | TCFGP1D106K8R |
| 廠商： | Rohm CO.,LTD. |
| 英文描述： | Chip tantalum capacitors with open-function built-in |
| 中文描述： | 以開放式功能的內(nèi)置芯片鉭電容器中 |
| 文件頁數(shù)： | 12/16頁 |
| 文件大?。?/td> | 139K |
| 代理商： | TCFGP1D106K8R |
TCFG series
Tantalum capacitors
(5) External temperature vs. fuse blowout (6) Power vs. fuse blowout characteristics / Product sur-
face temperature
12/15
TIME
(sec)
Fig.8
E
°
C
260
270
280
290
300
310
320
330
340
350
360
B case (3528)
A case (3216)
Failed
Half failed
No failed
1
10
100
ELECTRIC POWER
(W)
Fig.9
O
0
10
20
30
40
50
60
70
80
90
100
0
2
4
No operating area
6
8
10
9
7
5
3
1
Open-function charcteristic
Surface temp.
curve of the products
Operating area
150
200
250
300
S
°
C
B case (3528)
A case (3216)
Note: Solder the chip at 300
°
C or less. If it is soldered using
a temperature higher than 300
°
C, open function built-in may operate.
(7) Maximum power dissipation
Warming of the capacitor due to ripple voltage balances with warming caused by Joule heating and by radiated heat.
Maximum allowable warming of the capacitor is to 5
°
C above ambient temperature. When warming exceeds 5
°
C, it can
damage the dielectric and cause a short circuit.
Power dissipation (P) = I
2
$
R
Ripple current
P : As shown in table at right
R : Equivalent series resistance
Notes:
1. Please be aware that when case size is changed, maximum allowable power dissipation is reduced.
2. Maximum power dissipation varies depending on the package. Be sure to use a case which will keep warming within
the limits shown in the table below.
Allowable power dissipation (W) and maximum temperature rising
+
25
°
C
+
55
°
C
+
85
°
C
+
125
°
C
0.070
A case (3216)
0.063
0.056
0.028
0.025
P case (2012)
0.022
0.020
0.010
0.080
B case (3528)
0.072
0.064
0.032
5
Max. temp. rise
5
5
2
Case
Ambient
temp.
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