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參數(shù)資料
| 型號： | TCFGA1D106M8R |
| 廠商： | Rohm CO.,LTD. |
| 英文描述： | Chip tantalum capacitors with open-function built-in |
| 中文描述： | 以開放式功能的內置芯片鉭電容器中 |
| 文件頁數(shù)： | 15/16頁 |
| 文件大?。?/td> | 139K |
| 代理商： | TCFGA1D106M8R |
TCFG series
Tantalum capacitors
1) Do not allow solvent to come to a boil (kinetic energy increases).
$
Ultrasonic output 0.5W / cm
or less
$
Use a solvent with a high boiling point.
$
Lower solvent temperature.
2) Ultrasonic cleaning frequency
28 kHz or less
3) Keep cleaning time as short as possible.
4) Move item being cleaned.
Standing waves caused by the ultrasonic waves can cause stress to build up in part of the item being cleaned.
Reference
15/15
Kinetic energy = 2 x
π
x frequency x
propagation speed x solvent density
2 x ultrasonic output
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