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參數(shù)資料
| 型號： | TC2117-3.0EB |
| 廠商： | Microchip Technology Inc. |
| 英文描述： | 800 mA Fixed Low Dropout Positive Regulator |
| 中文描述： | 800毫安固定低壓差穩(wěn)壓器正 |
| 文件頁數(shù)： | 11/18頁 |
| 文件大?。?/td> | 751K |
| 代理商： | TC2117-3.0EB |
2006 Microchip Technology Inc.
DS21665C-page 11
TC2117
3-Lead Plastic Small Outline Transistor (DB) (SOT-223)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
0.85
3.15
0.65
2.90
0.90
.033
.124
.026
.114
.035
b
Lead Width
Tab Lead Width
Foot Length
Lead Angle
Mold Draft Angle, Top
Mold Draft Angle, Bottom
0.35
0.23
.014
.009
c
Lead Thickness
6.70
6.30
.264
.248
D
Overall Length
7.30
3.70
.287
.146
E
E1
Overall Width
Molded Package Width
1.80
0.10
–
.071
.004
–
A
A1
Overall Height
Standoff
4.60 BSC
.181 BSC
e1
Outside lead pitch (basic)
2.30 BSC
.091 BSC
e
Pitch
MAX
MIN
MAX
MIN
Dimension Limits
MILLIMETERS
*
NOM
INCHES
NOM
Units
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
JEDEC Equivalent TO-261 AA
Drawing No. C04-032
Notes:
*
Controlling Parameter
.130
3.30
.264
6.70
b2
L
φ
α
β
–
–
–
–
–
.118
.030
.012
.256
.138
–
–
.276
3.00
–
0.30
0.76
–
–
3.50
6.50
7.00
–
–
0.37
10°
10°
0°
10°
16°
–
10°
16°
–
10°
16°
10°
16°
Molded Package Height
1.65
1.55
.063
.065
A2
.061
1.60
.001
0.02
Revised 09-13-05
b2
D
E1
E
e
e1
1
A
A1
A2
α
β
φ
L
b
c
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