參數(shù)資料
型號: TC05BCOA
廠商: TelCom Semiconductor, Inc.
英文描述: LOW POWER, BANDGAP VOLTAGE REFERENCES
中文描述: 低功耗,帶隙電壓參考
文件頁數(shù): 2/4頁
文件大?。?/td> 46K
代理商: TC05BCOA
3-6
TELCOM SEMICONDUCTOR, INC.
ABSOLUTE MAXIMUM RATINGS*
Forward Current .................................................... +10mA
Reverse Current.................................................... +30mA
Storage Temperature Range ................– 65
°
C to +150
°
C
Operating Temperature Range
TO-92 Package .....................................0
°
C to +70
°
C
Surface Mount Package ........................0
°
C to +70
°
C
Lead Temperature (Soldering, 10 sec)
TO-92 Package ..............................................+300
°
C
Surface Mount Package .................................+300
°
C
Power Dissipation ............................. Limited by Forward/
Reverse Current
*Functional operation above the absolute maximum stress ratings is not
implied.
ELECTRICAL CHARACTERISTICS:
T
A
= +25
°
C, unless otherwise specified.
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
V
BR
Reverse Breakdown Voltage:
TC04
TC05
Reverse Breakdown Voltage Change:
TC04
I
R
= 100
μ
A
1.24
2.45
1.26
2.50
1.28
2.60
V
DV
BR
15
μ
A < I
R
< 20mA
20
μ
A < I
R
< 1mA
20
μ
A < I
R
< 20mA
25
μ
A < I
R
< 1mA
I
R
= 100
μ
A
10
0.25
10
0.25
20
1
20
1
mV
TC05
TC
Temperature Coefficient:
TC04A/TC05A
TC04B/TC05B
Reverse Current:
TC04
TC05
0.003
0.003
0.005
0.01
%/
°
C
I
R
0.015
0.020
20
20
mA
LOW POWER, BANDGAP
VOLTAGE REFERENCES
TC04A
TC04B
TC05A
TC05B
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