Thermally Conductive Epoxy Adhesive TC-2810 Storage and Shelf Life Storage: Store 3M Thermally Cond" />
參數(shù)資料
型號: TC-2810 37ML
廠商: 3M
文件頁數(shù): 5/6頁
文件大?。?/td> 0K
描述: THERM COND ADH TC-2810 37 ML
MSDS 材料安全數(shù)據(jù)表: TC-2810 MSDS
標準包裝: 12
類型: 環(huán)氧樹脂粘合劑,2 件
尺寸/尺寸: 1.25 盎司注射器
其它名稱: 3M9588
62266214352
3M
Thermally Conductive Epoxy Adhesive TC-2810
Storage and Shelf Life
Storage: Store 3M Thermally Conductive Epoxy Adhesive TC-2810 at 60-80°F (15-27°C) or refrigerate for maximum
shelf life and to reduce filler settling.
Shelf Life: Epoxy Adhesive TC-2810 has a shelf life of 12 months after date of manufacture when stored in the original
packaging and 60-80°F (15-27°C) room temperature storage conditions.
3M Thermally Conductive Pads
5516 / 5516S
0.5, 1.0, 1.5, 2.0
3.1
5519/5519S
0.5, 1.0, 1.5, 2.0
4.1
5591S
0.5, 1.0, 1.5, 2.0
1.0
5592/5592S
0.5, 1.0, 1.5, 2.0
1.1
5595/5595S
0.5, 1.0, 1.5, 2.0
1.6
General Information
Product selection table for 3M Thermally Conductive Materials.
Bulk Thermal
Thickness
Conductivity
Product
(mm)
(W/m-K)
Typical Applications
3M Thermally Conductive Tapes
8805
0.127
8810
0.25
0.6
8815
0.375
8820
0.50
9889FR
1.0
0.5
Applications requiring thin bonding with good thermal transfer; CPU, flex
circuit and power transformer bonding to heat sinks and other cooling
devices. Superior tack and wetting properties.
Applications requiring gap filling and bonding with good thermal transfer;
plasma display, IC packages and PCB bonding to heat sinks, metal cases
and other cooling devices.
Applications requiring gap filling and superior thermal performance
without bonding. IC package and PCB thermal interfacing with heat sinks
or other cooling devices and metal cases.
Only the “S” versions are available in 0.5 mm thicknesses.
“S” designation signifies a PET or PEN film on one side to provide a non-tacky surface.
“H” designation signifies a product with one one-tacky surface without the use of PET film.
3M Thermally Conductive Epoxy Adhesives
TC-2707
0.7
DP-190 Gray
0.4
Applications requiring high adhesive strength, good surface wet-out, gap
filling and good thermal transfer. Provides IC package and PCB thermal
interfacing with heat sinks or other cooling devices.
3M Thermally Conductive Pads (Acrylic)
5589H
1.0, 1.5
2.0
5590H
0.5, 1.0, 1.5
3.0
These pads use an acrylic elastomer for applications that require a non-
silicone thermal pad. Provides IC package and PCB thermal interfacing
with heat sinks or other cooling devices, and metal cases.
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