參數(shù)資料
型號： TB5R1LD
廠商： Texas Instruments, Inc.
英文描述： QUAD DIFFERENTIAL PECL RECEIVERS
中文描述： 四路差分PECL接收機
文件頁數(shù)： 2/11頁
文件大?。?/td> 327K
代理商： TB5R1LD
www.ti.com
POWER DISSIPATION RATINGS
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
TB5R1, TB5R2
SLLS588B–NOVEMBER 2003–REVISED MAY 2004
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
PART NUMBER
TB5R1DW
TB5R1D
TB5R2DW
TB5R2D
TB5R1LDW
TB5R1LD
TB5R2LDW
TB5R2LD
PART MARKING
TB5R1
TB5R1
TB5R2
TB5R2
TB5R1
TB5R1
TB5R2
TB5R2
Package
Gull-Wing SOIC
SOIC
Gull-Wing SOIC
SOIC
Gull-Wing SOIC
SOIC
Gull-Wing SOIC
SOIC
LEAD FINISH
NiPdAu
NiPdAu
NiPdAu
NiPdAu
SnPb
SnPb
SnPb
SnPb
STATUS
Production
Production
Production
Production
Production
Production
Production
Production
THERMAL RESIST-
ANCE,JUNCTION-TO-
AMBIENTWITH NO AIR
FLOW
131.1
°
C/W
84.1
°
C/W
120.3
°
C/W
80.8
°
C/W
CIRCUIT BOARD
MODEL
POWER RATINGT
A
≤
25
°
C
DERATINGFACT
OR
(1)
T
A
≥
25
°
C
POWER RATINGT
A
=
85
°
C
PACKAGE
Low-K
(2)
High-K
(3)
Low-K
(2)
High-K
(3)
763 mW
1190 mW
831 mW
1240 mW
7.6 mW/
°
C
11.9 mW/
°
C
8.3 mW/
°
C
12.4 mW/
°
C
305 mW
475 mW
332 mW
494 mW
D
DW
(1)
(2)
(3)
This is the inverse of the junction-to-ambient thermal resistance when board-mounted with no air flow.
In accordance with the low-K thermal metric definitions of EIA/JESD51-3.
In accordance with the high-K thermal metric definitions of EIA/JESD51-7.
THERMAL CHARACTERISTICS
PARAMETER
PACKAGE
D
DW
D
DW
VALUE
47.5
53.7
44.2
47.1
UNIT
°
C/W
°
C/W
°
C/W
°
C/W
Junction-to-Board
Thermal Resistance
θ
JB
Junction-to-Case
Thermal Resistance
θ
JC
UNIT
0 V to 6 V
8.4 V
±
3 kV
±
2 kV
Supply voltage, V
CC
Magnitude of differential bus (input) voltage, |V
AI
- V|, |V
BI
- V|, |V
CI
- V|, |V
DI
- V|
Human Body Model
(2)
ESD
Charged-Device Model
(3)
Continuous power dissipation
Storage temperature, T
stg
All pins
All pins
See Dissipation Rating Table
-65
°
C to 150
°
C
(1)
Stresses beyond those listed under,, absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under,, recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Tested in accordance with JEDEC Standard 22, Test Method A114-A.
Tested in accordance with JEDEC Standard 22, Test Method C101.
(2)
(3)
2
相關PDF資料
PDF描述
TB5R1LDW QUAD DIFFERENTIAL PECL RECEIVERS
TB5R2LD QUAD DIFFERENTIAL PECL RECEIVERS
TB5R2LDW QUAD DIFFERENTIAL PECL RECEIVERS
TB5T1DR Low Power 5V RS232 Dual Driver/Receiver with 0.1?μF Capacitors; Package: SO; No of Pins: 16; Temperature Range: -40?°C to 85?°C
TB5T1LD Low Power 5V RS232 Dual Driver/Receiver with 0.1?μF Capacitors; Package: SO; No of Pins: 16; Temperature Range: -40?°C to 85?°C
相關代理商/技術參數(shù)
參數(shù)描述
TB5R1LDR 功能描述:LVDS 接口集成電路 Hi Spd Diff Receiver RoHS:否 制造商:Texas Instruments 激勵器數(shù)量:4 接收機數(shù)量:4 數(shù)據(jù)速率:155.5 Mbps 工作電源電壓:5 V 最大功率耗散:1025 mW 最大工作溫度:+ 85 C 封裝 / 箱體:SOIC-16 Narrow 封裝:Reel
TB5R1LDW 功能描述:LVDS 接口集成電路 Hi Spd Diff Receiver RoHS:否 制造商:Texas Instruments 激勵器數(shù)量:4 接收機數(shù)量:4 數(shù)據(jù)速率:155.5 Mbps 工作電源電壓:5 V 最大功率耗散:1025 mW 最大工作溫度:+ 85 C 封裝 / 箱體:SOIC-16 Narrow 封裝:Reel
TB5R1LDWR 功能描述:LVDS 接口集成電路 Hi Spd Diff Receiver RoHS:否 制造商:Texas Instruments 激勵器數(shù)量:4 接收機數(shù)量:4 數(shù)據(jù)速率:155.5 Mbps 工作電源電壓:5 V 最大功率耗散:1025 mW 最大工作溫度:+ 85 C 封裝 / 箱體:SOIC-16 Narrow 封裝:Reel
TB5R2 制造商:TI 制造商全稱:Texas Instruments 功能描述:QUAD DIFFERENTIAL PECL RECEIVERS
TB5R2D 功能描述:LVDS 接口集成電路 Quad PECL Line Receiver RoHS:否 制造商:Texas Instruments 激勵器數(shù)量:4 接收機數(shù)量:4 數(shù)據(jù)速率:155.5 Mbps 工作電源電壓:5 V 最大功率耗散:1025 mW 最大工作溫度:+ 85 C 封裝 / 箱體:SOIC-16 Narrow 封裝:Reel
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