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Error Reporting
Over Current (OC) Protection With Current
Device Protection System
SLES188 – AUGUST 2006
Limiting and Overload Detection
The
SD
and
OTW
pins
are
both
active-low,
open-drain
outputs.
Their
function
is
for
The device has independent, fast-reacting current
protection-mode signaling to a PWM controller or
detectors with programmable trip threshold (OC
other system-control device. Any fault resulting in
threshold) on all high-side and low-side power-stage
device shutdown is signaled by the SD pin going low.
FETs. See
Table 3 for OC-adjust resistor values. The
Likewise, OTW goes low when the device junction
detector outputs are closely monitored by two
temperature exceeds 115
protection systems. The first protection system
controls the power stage in order to prevent the
Table 2. Error Reporting
output current from further increasing. For instance, it
performs a current-limiting function
rather
than
SD
OTW
DESCRIPTION
prematurely shutting down during combinations of
Over Temperature (OTE) or Over
high-level music transients and extreme speaker
0
Load (OLP) or Under Voltage (UVP)
load impedance drops. If the high-current situation
Over Load (OLP), PWM Activity
persists, i.e., the power stage is being overloaded, a
0
1
Dectector, or Under Voltage (UVP)
second
protection
system
triggers
a
latching
Over Temperature Warning. Junction
shutdown, resulting in the power stage being set in
1
0
temperature higher than 125
°C.
the high-impedance (Hi-Z) state.
Normal operation. Junction
1
temperature lower than 125
°C.
Table 3. OC-Adjust Resistor Values
It should be noted that asserting RESET low forces
CURRENT BEFORE OC OCCURS
OC-ADJUST
(A)
the SD and OTW signals high, independent of faults
RESISTOR VALUES
(k
) (1)
being present. It is recommended to monitor the
MIN
TYP
MAX
OTW signal using the system microcontroller and
22
15
16
17
respond to an overtemperature warning signal by, for
27
12
13
14
example, turning down the volume to prevent further
47
7
8
heating of the device resulting in device shutdown
68
5
6
(OTW). To reduce external component count, an
internal pullup resistor to 3.3 V is provided on both
100
3
4
the SD and OTW outputs. Level compliance for 5-V
(1)
Resistor tolerance is
±5%.
logic can be obtained by adding external pullup
resistors to 5 V (see the Electrical Characteristics
For
lowest-cost
bill
of
materials
in
terms
of
section of this data sheet for further specifications).
component selection, the OC threshold current
should be limited, considering the power output
requirement
and
minimum
load
impedance.
Higher-impedance
loads
require
a
lower
OC
The TAS5261 contains advanced protection circuitry
threshold.
carefully designed to facilitate system integration and
ease of use, as well as safeguarding the device from
The demodulation filter inductor must retain a
permanent failure due to a wide range of fault
minimum of 5-H inductance at twice the selected OC
conditions, such as short circuit, overload, and
threshold current.
undervoltage. The TAS5261 responds to a fault by
Most inductors have decreasing inductance with
immediately
setting
the
power
stage
in
a
increasing
temperature
and
increasing
current
high-impedance state (Hi-Z) and asserting the SD
(saturation).
To
some
degree,
an
increase
in
pin low. In situations other than overload, the device
temperature naturally occurs when operating at high
automatically recovers when the fault condition has
output currents, due to inductor core losses and the
been
removed
(e.g.,
the
voltage
supply
has
dc resistance of the inductor copper winding. A
increased). For highest possible reliability, recovering
thorough analysis of inductor saturation and thermal
from an overload fault requires external reset of the
properties is strongly recommended.
device no sooner than 1 s after the shutdown (see
the Device Reset section of this data sheet).
Setting the OC threshold too low might cause issues,
such as lack of enough output power and/or
unexpected shutdowns due to sensitive overload
detection.
In general, it is recommended to follow closely the
external component selection and PCB layout as
given in the Application Information section of this
data sheet.
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