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參數資料
| 型號： | TAS5121DKDRE4 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 100 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO36 |
| 封裝： | GREEN, PLASTIC, HSSOP-36 |
| 文件頁數： | 6/21頁 |
| 文件大小： | 591K |
| 代理商： | TAS5121DKDRE4 |
TAS5121
SLES086A NOVEMBER 2003 REVISED MARCH 2004
www.ti.com
14
RθJA is a system thermal resistance from junction to
ambient air. As such, it is a system parameter with roughly
the following components:
D RθJC (the thermal resistance from junction to
case, or in this case the metal pad)
D Heatsink compound thermal resistance
D Heatsink thermal resistance
The thermal grease thermal resistance can be calculated
from the exposed pad area and the thermal grease
manufacturer’s area thermal resistance (expressed in
°C-in2/W). The area thermal resistance of the example
thermal grease with a 0.001-inch thick layer is about 0.054
°C-in2/W. The approximate exposed pad area is as
follows:
36-pin PSOP3
0.116 in2
Dividing the example thermal grease area resistance by
the area of the pad gives the actual resistance through the
thermal grease for the device:
36-pin PSOP3
0.47
°C/W
The thermal resistance of thermally conductive pads is
generally higher than a thin thermal grease layer. Thermal
tape has an even higher thermal resistance and should not
be used with this package.
Heatsink thermal resistance is generally predicted by the
heatsink vendor, modeled using a continuous flow
dynamics (CFD) model, or measured.
Thus, for a single monaural IC, the system RθJA = RθJC +
thermal grease resistance + heatsink resistance.
The following table indicates modeled parameters for one
TAS5121 IC on a heatsink. The junction temperature is set
at 110
°C while delivering 70 W RMS into 4- loads with no
clipping. It is assumed that the thermal grease is about
0.001 inch thick (this is critical).
Table 4. Example of Thermal Simulation
36-Pin PSOP3
Ambient temperature
25
°C
Power to load
70 W
Delta T inside package
5.5
°C
Delta T through thermal grease
3.2
°C
Required heatsink thermal resistance
11.0
°C/W
Junction temperature
110
°C
System RθJA
12.3
°C/W
RθJA * power dissipation
85
°C
RθJC
0.85
°C/W
As an indication of the importance of keeping the thermal
grease layer thin, if the thermal grease layer increases to
0.002 inches thick, the required heatsink thermal
resistance increases to 5.2
°C/W for the PSOP3 package.
REFERENCES
1.
Digital Audio Measurements application report—TI
(SLAA114)
2.
PowerPAD
Thermally
Enhanced
Package
technical brief—TI (SLMA002)
3.
System Design Considerations for True Digital
Audio Power Amplifiers application report—TI
(SLAA117)
4.
Voltage
Spike
Measurement
Technique
and
Specification application note—TI (SLEA025)
相關PDF資料 |
PDF描述 |
|---|---|
| TAS5121DKDR | 100 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO36 |
| TAS5121DKD | 100 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO36 |
| TAS5121IDKDE4 | 100 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO36 |
| TAS5121IDKDRE4 | 100 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO36 |
| TAS5121IDKDR | 100 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO36 |
相關代理商/技術參數 |
參數描述 |
|---|---|
| TAS5121I | 制造商:TI 制造商全稱:Texas Instruments 功能描述:DIGITAL AMPLIIFIER POWER STAGE |
| TAS5121IDKD | 功能描述:音頻放大器 Digital Amplifier Power Stage RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TAS5121IDKDE4 | 功能描述:音頻放大器 Digital Amplifier Power Stage RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TAS5121IDKDR | 功能描述:音頻放大器 Digital Amplifier Power Stage RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TAS5121IDKDRE4 | 功能描述:音頻放大器 Digital Amplifier Power Stage RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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