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參數(shù)資料
| 型號(hào)： | TAS5101IDAP |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 運(yùn)動(dòng)控制電子 |
| 英文描述： | Single Audio Amplifier |
| 中文描述： | 單音頻放大器 |
| 文件頁(yè)數(shù)： | 11/14頁(yè) |
| 文件大?。?/td> | 185K |
| 代理商： | TAS5101IDAP |
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TAS5101
SLES039
–
JUNE 2002
11
www.ti.com
THERMAL INFORMATION
The thermally enhanced DAP package is based on the 32-pin HTSSOP, but includes a thermal pad (see
Figure 4) to provide an effective thermal contact between the IC and the PWB.
Traditionally, surface mount and power have been mutually exclusive terms. A variety of scaled-down TO-220
type packages have leads formed as gull wings to make them applicable for surface-mount applications. These
packages, however, have two shortcomings: they do not address the very low profile requirements (<2 mm) of
many of today
’
s advanced systems, and they do not offer a terminal-count high enough to accommodate
increasing integration. On the other hand, traditional low-power surface-mount packages require
power-dissipation derating that severely limits the usable range of many high-performance analog circuits.
The PowerPAD package (thermally enhanced HTSSOP) combines fine-pitch surface-mount technology with
thermal performance comparable to much larger power packages.
The PowerPAD package is designed to optimize the heat transfer to the PWB. Because of the very small size
and limited mass of a HTSSOP package, thermal enhancement is achieved by improving the thermal
conduction paths that remove heat from the component. The thermal pad is formed using a patented lead-frame
design and manufacturing technique to provide a direct connection to the heat-generating IC. When this pad
is soldered or otherwise thermally coupled to an external heat dissipater, high power dissipation in the ultrathin,
fine-pitch, surface-mount package can be reliably achieved.
DIE
DIE
Thermal
Pad
Side View (a)
End View (b)
Bottom View (c)
Figure 3. Views of Thermally Enhanced DAP Package
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TAS5101IDAPR | Single Audio Amplifier |
| TAS5110 | Digital Amplifier Power Stage |
| TAS5110DAD | TRUE DIGITAL AUDIO AMPLIFIER TAS5110 PWM POWER OUTPUT STAGE |
| TAS5110DADR | TRUE DIGITAL AUDIO AMPLIFIER TAS5110 PWM POWER OUTPUT STAGE |
| TAS5110DAP | TRUE DIGITAL AUDIO AMPLIFIER TAS5110 PWM POWER OUTPUT STAGE |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TAS5101IDAPG4 | 功能描述:音頻放大器 Stereo Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TAS5101IDAPR | 功能描述:音頻放大器 Stereo Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TAS5101IDAPRG4 | 功能描述:音頻放大器 Stereo Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TAS5102 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:20-W/15-W STEREO DIGITAL AMPLIFIER POWER STAGE |
| TAS5102_1 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:20-W/15-W STEREO DIGITAL AMPLIFIER POWER STAGE |
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