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參數(shù)資料
| 型號： | T6B70BFNG |
| 元件分類： | 模擬信號調(diào)理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, PDSO16 |
| 封裝： | 0.225 INCH, 0.65 MM PITCH, PLASTIC, SSOP-16 |
| 文件頁數(shù)： | 7/21頁 |
| 文件大?。?/td> | 367K |
| 代理商： | T6B70BFNG |
T6B70BFNG
2008-05-15
15
Toshiba CMOS SSOP Embossed Taping - Common Specifications
1. Applicable Scope
This specification defines the embossed taping package specifications and related items for Toshiba flat
package CMOS ICs.
2. Specifications
2.1
Tape Form and Dimensions
Unit: mm
Package Code
A0
B0
P1
T
K
T2
D1
SSOP16-P-225-0.65B
6.8
± 0.1
5.5
± 0.1
8.0
± 0.1
0.3
± 0.1
2.15
± 0.3
2.45 MAX
1.65
± 0.1
Note: The maximum value of K dimensions is adopted in the table though the one that the tape thickness was added
to K dimensions becomes T2 dimensions.
(The Tape thickness is considered within the range of the allowance of K dimensions.)
2.2
Seal Tape Dimensions
Unit: mm
Tape Width
Tape Thickness
SSOP16-P-225-0.65B
13.5
0.06
Direction of feed
Composition explanation chart (example)
Top cover tape
Emboss carrier tape
Sending hole
Emboss equipment hole
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