參數(shù)資料
型號(hào): T520X477M006SE018
廠商: Texas Instruments, Inc.
英文描述: 60-A, 3.3/5-V INPUT, NONISOLATED WIDE-OUTPUT ADJUST POWER MODULE
中文描述: 60甲,3.3/5-V輸入,非隔離寬輸出調(diào)節(jié)電源模塊
文件頁(yè)數(shù): 2/24頁(yè)
文件大?。?/td> 947K
代理商: T520X477M006SE018
www.ti.com
STANDARD APPLICATION
PTH04040W
19
20
18
Margin
Down
Track
Margin
Up
12
15
9
14
11
+
+
+
1
3
5
10
13
16
17
UVLO
4
6
2
8
Inhibit
GND
GND
VoAdj
Sense
Vo
+Sense
UDG05085
A
B
C
C
V
O
C
1
330
μ
F
C
O
2
330
μ
F
R
SET
1%
0.05 W
C
I
1000
μ
F
(Required)
V
I
V
I
7
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
PTH04040W
SLTS238A–SEPTEMBER 2005–REVISED FEBRUARY 2006
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
A.
B.
C.
For C
I
, a minimum of 1,000
μ
F (or 2
×
470
μ
F) of input capacitance is required for proper operation.
R
SET
is required to set the desired output voltage from the module higher than the minimum value.
For C
O
1 and C
O
2, a minimum of 660
μ
F (or 2
×
330
μ
F) of input capacitance is required load transient regulation.
ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see
the TI website at www.ti.com.
UNIT
Signal input voltages
Operating temperature range over V
I
range
Wave solder
temperature
Track control (pin 18)
–0.3 V to V
I
+ 0.3 V
–40
°
C to 85
°
C
260
°
C
(1)
T
A
Surface temperature of module body or pins
(5
seconds)
PTH04040WAH
T
wave
PTH04040WAS
PTH04040WAZ
235
°
C
(1)
260
°
C
(1)
–40
°
C to 125
°
C
500 G
(2)
10 G
(2)
22.5 grams
Solder reflow
temperature
T
reflow
Surface temperature of module body or pins
T
S
Storage temperature
Mechanical shock
Mechanical vibration
Weight
Flammability
Per Mil-STD-883D, Method 2002.3, 1 msec, 1/2 Sine, mounted
Mil-STD-883D, Method 2007.2, 20–2000 Hz
Meets UL94V-O
(1)
During soldering of package version, do not elevate peak temperature of the module, pins or internal components above the stated
maximum.
Qualification limits
(2)
2
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