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參數(shù)資料
型號: SY89853UMG TR
廠商: Micrel Inc
文件頁數(shù): 4/9頁
文件大小: 0K
描述: IC CLOCK MUX 2:1 2.5GHZ 32-MLF
標(biāo)準(zhǔn)包裝: 1,000
系列: Precision Edge®
類型: 多路復(fù)用器
電路數(shù): 2
比率 - 輸入:輸出: 2:1
差分 - 輸入:輸出: 是/是
輸入: CML,LVDS,PECL
輸出: LVPECL
頻率 - 最大: 2.5GHz
電源電壓: 2.375 V ~ 3.6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 32-VFQFN 裸露焊盤,32-MLF?
供應(yīng)商設(shè)備封裝: 32-MLF?(5x5)
包裝: 帶卷 (TR)
其它名稱: SY89853UMGTR
SY89853UMGTR-ND
Micrel, Inc.
SY89853U
August 2007
4
M9999-082907-C
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings
(1)
Supply Voltage (VCC) ............................–0.5V to +4.0V
Input Voltage (VIN) ....................................–0.5V to VCC
LVPECL Output Current (IOUT)
Continuous................................................. ±50mA
Surge ....................................................... ±100mA
Termination Current
Source or Sink Current on VT .................... ±50mA
Input Current
Source or Sink Current on IN, /IN .............. ±50mA
Current (VREF-AC)
Source or Sink Current on VREF-AC ............... ±2mA
Lead Temperature (soldering, 20sec.) ...............260°C
Storage Temperature (Ts) .................–65°C to +150°C
Operating Ratings
(2)
Supply Voltage (VCC) .....................+2.375V to +2.625V
..................................................... +3.0V to +3.6V
Ambient Temperature (TA)....................–40°C to +85°C
Package Thermal Resistance
(3)
QFN (
θ
JA)
Still-Air......................................................35°C/W
500lfpm ....................................................28°C/W
QFN (
ψ
JB)
Junction-to-Board.....................................16°C/W
DC Electrical Characteristics
(4)
TA = –40°C to +85°C, unless otherwise noted.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply
VCC = 2.5V
VCC = 3.3V
2.375
3.0
2.5
3.3
2.625
3.6
V
ICC
Power Supply Current
No load, max. VCC.
65
85
mA
RIN
Input Resistance
(IN-to-VT)
45
50
55
RDIFF_IN
Differential Input Resistance
(IN-to-/IN)
90
100
110
VIH
Input High Voltage
(IN, /IN)
Note 5
VCC– 1.6
VCC
V
VIL
Input Low Voltage
(IN, /IN)
0
VIH– 0.1
V
VIN
Input Voltage Swing
(IN-to-/IN)
See Figure 1a.
0.1
1.7
V
VDIFF_IN
Differential Input Voltage Swing
|IN - /IN|
See Figure 1b.
0.2
V
VT_IN
Maximum Input Voltage
(IN-to-VT)
1.28
V
VREF-AC
Output Reference Voltage
VCC– 1.3
VCC– 1.2
VCC– 1.1
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions
for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
θ
JA and ψJB
values are determined for a 4-layer board in still-air, unless otherwise stated.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
5. VIH (min) not lower than 1.2V.
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