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參數(shù)資料
型號: SY89846UMG
廠商: Micrel Inc
文件頁數(shù): 4/9頁
文件大?。?/td> 0K
描述: IC CLK BUFF MUX 2:5 2GHZ 32-MLF
標準包裝: 60
系列: Precision Edge®
類型: 扇出緩沖器(分配),多路復(fù)用器
電路數(shù): 1
比率 - 輸入:輸出: 2:5
差分 - 輸入:輸出: 是/是
輸入: CML,LVDS,PECL
輸出: LVPECL
頻率 - 最大: 2GHz
電源電壓: 2.375 V ~ 3.6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 32-VFQFN 裸露焊盤,32-MLF?
供應(yīng)商設(shè)備封裝: 32-MLF?(5x5)
包裝: 管件
產(chǎn)品目錄頁面: 1084 (CN2011-ZH PDF)
其它名稱: 576-1617
Micrel, Inc.
SY89846U
Oct. 1, 2013
M9999-072211B
hbwhelp@micrel.com or (408) 955-1690
4
Absolute Maximum Ratings
(1)
Supply Voltage (VCC) .......................... –0.5V to +4.0V
Input Voltage (VIN) ..................................–0.5V to VCC
LVPECL Output Current (IOUT)
Continuous ..................................................50mA
Surge.........................................................100mA
Current (VT)
Source or sink on VT pin.........................±100mA
Input Current
Source or sink current on (IN, /IN) ............±50mA
Current (VREF)
Source or sink current on VREF-AC
(4) ..........±0.5mA
Maximum operating Junction Temperature ..... 125°C
Lead Temperature (soldering, 20sec.) ............. 260°C
Storage Temperature (Ts)................–65°C to +150°C
Operating Ratings
(2)
Supply Voltage (VCC) ..................+2.375V to +2.625V
.....................................................+3.0V to +3.6V
Ambient Temperature (TA)................ –40°C to +85°C
Package Thermal Resistance
(3)
QFN (
JA)
Still-Air ..................................................... 50°C/W
QFN (
JB)
Junction-to-Board .................................... 31°C/W
DC Electrical Characteristics
(5)
TA = –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply Voltage
2.375
3.0
2.5
3.3
2.625
3.6
V
ICC
Power Supply Current
No load, max VCC
60
75
mA
RIN
Input Resistance
(IN-to-VT)
45
50
55
RDIFF_IN
Differential Input Resistance
(IN-to-/IN)
90
100
110
VIH
Input HIGH Voltage
(IN, /IN)
0.1
VCC
V
VIL
Input LOW Voltage
(IN, /IN)
0
VIH–0.1
V
VIN
Input Voltage Swing
(IN, /IN)
See Figure 2a. Note 6
0.1
1.0
V
VDIFF_IN
Differential Input Voltage Swing
|IN-/IN|
See Figure 2b.
0.2
1.9
V
VIN_FSI
Input Voltage Threshold that
Triggers FSI
30
100
mV
VREF-AC
Output Reference Voltage
IVREF-AC = + 0.5mA
VCC–1.3
VCC–1.2
VCC–1.1
V
VT_IN
Voltage from Input to VT
1.28
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is
not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
JA and
JB values are determined for a 4-layer board in still air unless otherwise stated.
4. Due to the limited drive capability, use for input of the same package only.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
6. VIN (max) is specified when VT is floating.
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