Precision Edge SY89832U Micrel, Inc. M9999-082407 hbwhelp@micrel.com or (408) 955-1690 August 2007
參數(shù)資料
型號(hào): SY89832UMI
廠商: Micrel Inc
文件頁(yè)數(shù): 4/10頁(yè)
文件大小: 0K
描述: IC CLK BUFFER TRANSLA 1:4 16-MLF
標(biāo)準(zhǔn)包裝: 100
系列: Precision Edge®
類(lèi)型: 扇出緩沖器(分配),變換器
電路數(shù): 1
比率 - 輸入:輸出: 1:4
差分 - 輸入:輸出: 是/是
輸入: CML,LVDS,LVPECL
輸出: LVDS
頻率 - 最大: 2.5GHz
電源電壓: 2.375 V ~ 2.625 V
工作溫度: -40°C ~ 85°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 16-VFQFN 裸露焊盤(pán),16-MLF?
供應(yīng)商設(shè)備封裝: 16-MLF?(3x3)
包裝: 管件
3
Precision Edge
SY89832U
Micrel, Inc.
M9999-082407
hbwhelp@micrel.com or (408) 955-1690
August 2007
Absolute Maximum Ratings(1)
Supply Voltage (VCC)................................... –0.5V to +4.0V
Input Voltage (VIN) ................................–0.5V to VCC +0.3V
LVDS Output Current (IOUT) .....................................±10mA
Input Current
Source or Sink Current on (IN, /IN) ..................±50mA
VREF-AC Current
Source or Sink Current on (IVT) ..........................±2mA
Lead Temperature (soldering, 20sec.) ...................... 260°C
Storage Temperature (TS) ........................–65°C to +150°C
Operating Ratings(2)
Supply Voltage Range ........................... +2.375V to 2.625V
Ambient Temperature (TA) .........................–40°C to +85°C
Package Thermal Resistance(3)
QFN
JA) Still-Air ........................................................ 60°C/W
JB) .................................................................... 32°C/W
TA = –40°C to +85°C, unless otherwise stated.
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Power Supply Current
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Differential Input Resistance
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Input LOW Voltage (IN,
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Differential Input Voltage Swing
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IN, /IN
VREF–AC
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CC–1.525 VCC–1.425 VCC–1.325
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Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied
at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratlng conditions for extended
periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB. ψ
JB and θJA values
are determined for a 4-layer board in stil-air number, unless otherrwise stated.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
5. Due to the internal termination (see "Input Buffer Structure" section) the input current depends on the applied voltages at IN, /IN and VT inputs. Do
not apply a combination of voltages that causes the input current to exceed the maximum limit!
DC ELECTRICAL CHARACTERISTICS(4)
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