
Micrel, Inc.
SY88289AL
February 2007
3
M9999-021207-B
Absolute Maximum Ratings
(1)
Supply Voltage (VCC) .................................... 0V to +4.0V
Input Voltage (DIN, /DIN) ................................... 0 to VCC
Output Current (IOUT) ............................................+25mA
/EN Voltage ........................................................ 0 to VCC
VREF Current……………………………-800uA to + 500uA
LOSLVL Voltage.............................................. VREF to VCC
Lead Temperature (soldering, 20sec.) .................. 260°C
Storage Temperature (Ts) .....................-65°C to +150°C
Operating Ratings
(2)
Supply Voltage (VCC)..............................+3.0V to +3.6V
Ambient Temperature (TA)....................–40°C to +85°C
Junction Temperature (TJ) ..................–40°C to +125°C
Junction Thermal Resistance
QFN (
θ
JA)
Still-air ..................................................... 60°C/W
QFN (
Ψ
JB)
Junction-to-board .....................................38
oC/W
DC Electrical Characteristics
VCC = 3.0V to 3.6V; RL = 50
to V
CC; TA = –40°C to +85°C.
Symbol
Parameter
Condition
Min
Typ
Max
Units
ICC
Power Supply Current
No output load
42
65
mA
LOSLVL
LOSLVL Voltage
VREF
VCC
V
VOH
CML Output HIGH Voltage
VCC-0.020
VCC-0.005
VCC
V
VOL
CML Output LOW Voltage
Vcc =3.3V
VCC-0.475
VCC-0.400
VCC-0.350
V
VOFFSET
Differential Output Offset
±80
mV
ZO
Single-Ended Output Impedance
40
50
60
ZI
Single-Ended Input Impedance
40
50
60
VREF
Reference Voltage
VCC-1.28
V
TTL DC Electrical Characteristics
VCC = 3.0V to 3.6V; RL = 50
to V
CC; TA = –40°C to +85°C.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VIH
/EN Input HIGH Voltage
2.0
VIL
/EN Input LOW Voltage
0.8
V
IIH
/EN Input HIGH Current
VIN = 2.7V
VIN = VCC
20
100
uA
IIL
/EN Input LOW Current
VIN = 0.5V
-300
uA
VOH
LOS Output HIGH Level
VCC > 3.3V, IOH-MAX < 160uA
VCC < 3.3V, IOH-MAX < 160uA
2.4
2.0
V
VOL
LOS Output LOW Level
Sinking 2mA
0.5
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional
operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential (GND)
on the PCB.
Ψ
JB uses 4-layer (θJA) in still-air number, unless otherwise stated.