參數(shù)資料
型號: SY58023U
英文描述: 10.7Gbps 2X2 Crosspoint Switch with CML Outputs and Internal Termination
中文描述: 10.7Gbps 2x2交叉點(diǎn)開關(guān)帶CML輸出和內(nèi)部終端
文件頁數(shù): 3/5頁
文件大?。?/td> 133K
代理商: SY58023U
3
SY58016L
Micrel
Absolute Maximum Ratings(Note 1)
Supply Voltage
V
CC – VEE| ........................................... +4.0V
Output Voltage (V
OUT) .............................. Max. VCC +0.5V
........................................................... Min. V
CC –1.0V
Maximum Input Current (I
IN) .................................... ±25mA
Maximum Output Current (I
OUT) .............................. ±25mA
Lead Temperature (Soldering, 10 sec.) .................... 220
°C
Operating Ratings(Note 2)
Supply Voltage (VIN)
Input Voltage (V
CC = 0V) ......................... –1.0V to +0.5V
Input Voltage (V
EE = 0V) ........... VCC –1.0V to VCC +0.5V
Ambient Temperature (T
A) ......................... –40°C to +85°C
Storage Temperature (T
S) ....................... –65°C to +150°C
Package Thermal Resistance
MLF
JA)
Still Air ............................................................. 60
°C/W
500lfpm ............................................................ 54
°C/W
MLF (
Ψ
JB)
(Note 4) ............................................................. 32
°C/W
V
EE = GND, VCC = +3.3V ±10%
Symbol
Parameter
Condition
Min
Typ
Max
Units
I
EE
Power Supply Current
50
75
mA
R
IN
Input Resistance
40
50
60
R
OUT
Output Source Impedance
40
50
60
V
IH
Input HIGH Voltage
V
CC–0.9
V
CC
V
IL
Input LOW Voltage
V
CC–1.0
V
CC–0.1
V
OH
Output HIGH Voltage
Note 1
V
CC–0.040
V
CC–0.010
V
CC
V
OL
Outuput LOW Voltage
Note 1
V
CC–0.400 VCC–0.325
V
OUT(swing)
Output Voltage Swing
Note 1
325
400
mVp-p
Note 1. 50
output load and input swing is more than 100mVp-p. See Figure 1 for Output Swing definition.
DC ELECTRICAL CHARACTERISTICS
Note 1.
Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. This is a stress rating only and functional operation is
not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to ABSOLUTE MAXIMUM RATlNG
conditions for extended periods may affect device reliability.
Note 2.
The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
Note 3.
The device is guaranteed to meet the DC specifications, shown in the table above, after thermal equilibrium has been established. The device
is tested in a socket such that transverse airflow of
≥500lfpm is maintained.
Note 4.
Junction-to-board resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
QOUT
/QOUT
VIN, VOUT
400mV (typical)
QOUT
/QOUT
VDIFF—IN,VDIFF—OU
800mV
QOUT — /QOUT
Figure 1. Input/Output Swing
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