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參數(shù)資料
| 型號： | SY54020RMG TR |
| 廠商： | Micrel Inc |
| 文件頁數(shù)： | 2/14頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC CLK BUFFER 1:4 2.5GHZ 16-MLF |
| 產(chǎn)品培訓模塊： | High Bandwidth Product Overview |
| 標準包裝： | 1,000 |
| 系列： | Precision Edge® |
| 類型： | 扇出緩沖器（分配） |
| 電路數(shù)： | 1 |
| 比率 - 輸入:輸出： | 1:4 |
| 差分 - 輸入:輸出： | 是/是 |
| 輸入： | CML，LVDS，LVPECL |
| 輸出： | CML |
| 頻率 - 最大： | 2.5GHz |
| 電源電壓： | 2.375 V ~ 2.625 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-VFQFN 裸露焊盤，16-MLF? |
| 供應商設備封裝： | 16-MLF?（3x3） |
| 包裝： | 帶卷 (TR) |
IDT / ICS 3.3V, 2.5V LVPECL TRANSLATOR
10
ICS8532AMI REV A NOVEMBER 13, 2006
ICS85320I
LVCMOS/LVTTL-TO-DIFFERENTIAL 3.3V, 2.5V LVPECL TRANSLATOR
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS85320I.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS85320I is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC
= 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
CC_MAX
* I
EE_MAX
= 3.465V * 25mA = 86.6mW
Power (outputs)
MAX
= 30.2mW/Loaded Output pair
Total Power
_MAX
(3.465V, with all outputs switching) = 86.6mW + 30.2mW = 116.6mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
TM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 103.3°C/W per Table 5 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.117W * 103.3°C/W = 97.1°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
TABLE 5. THERMAL RESISTANCE
θθθθθ
JA
FOR
8-PIN SOIC, FORCED CONVECTION
θθθθθ
JA
by Velocity (Linear Feet per Minute)
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
153.3°C/W
128.5°C/W
115.5°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
112.7°C/W
103.3°C/W
97.1°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
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參數(shù)描述 |
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| SY54023AR | 制造商:MICREL 制造商全稱:Micrel Semiconductor 功能描述:Low Voltage 1.2V/1.8V CML 2x2 Crosspoint Switch 3.2Gbps, 3.2GHz |
| SY54023ARMG | 功能描述:模擬和數(shù)字交叉點 IC 1.2/1.8V Low Voltage CML 2x2 Crosspoint Switch RoHS:否 制造商:Micrel 配置:2 x 2 封裝 / 箱體:MLF-16 數(shù)據(jù)速率:10.7 Gbps 輸入電平:CML, LVDS, LVPECL 輸出電平:CML 電源電壓-最大:3.6 V 電源電壓-最小:2.375 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 產(chǎn)品:Digital Crosspoint 封裝:Tube |
| SY54023ARMG TR | 功能描述:模擬和數(shù)字交叉點 IC 1.2/1.8V Low Voltage CML 2x2 Crosspoint Switch RoHS:否 制造商:Micrel 配置:2 x 2 封裝 / 箱體:MLF-16 數(shù)據(jù)速率:10.7 Gbps 輸入電平:CML, LVDS, LVPECL 輸出電平:CML 電源電壓-最大:3.6 V 電源電壓-最小:2.375 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 產(chǎn)品:Digital Crosspoint 封裝:Tube |
| SY54023ARMGTR | 制造商:MICREL 制造商全稱:Micrel Semiconductor 功能描述:Low Voltage 1.2V/1.8V CML 2x2 Crosspoint Switch 3.2Gbps, 3.2GHz |
| SY54023R | 制造商:MICREL 制造商全稱:Micrel Semiconductor 功能描述:Low Voltage 1.2V/1.8V CML 2x2 Crosspoint Switch with Fail-Safe Inputs, 3.2Gbps, 2.5GHz |
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