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參數(shù)資料
| 型號： | STDD15-07S |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | LOW CAPACITANCE DETECTION DIODE |
| 中文描述： | 低電容二極管檢測 |
| 文件頁數(shù)： | 3/6頁 |
| 文件大?。?/td> | 42K |
| 代理商： | STDD15-07S |
STDD15 series
3/6
1.E-01
1.E+00
1.E+01
1.E+02
0.0
0.2
0.4
0.6
0.8
1.0
1.2
VFM(V)
Tj=125°C
Tj=85°C
Tj=25°C
Tj=-40°C
IFM(mA)
Fig. 1:
current (typical values).
Forward voltage drop versus forward
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0.0
2.5
5.0
7.5
10.0
12.5
15.0
VR(V)
Tj=125°C
Tj=85°C
Tj=25°C
IR(μA)
Fig. 2:
Reverse leakage current versus reverse
voltage applied (typical values).
1
10
100
1.0
10.0
100.0
IF(mA)
F=10kHz
Tj=25°C
RF( )
Fig. 3:
forward current (typical values).
Differential forward resistance versus
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.0
2.5
5.0
7.5
10.0
12.5
15.0
VR(V)
F=1MHz
Vosc=30mV
RMS
Tj=25°C
C(pF)
Fig. 4:
voltage applied (typical values).
Junction capacitance versus reverse
10.0
100.0
1000.0
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
tp(s)
Zth(j-a)(°C/W)
Fig. 5:
Variation of thermal impedance junction to
ambient versus pulse duration (printed circuit
board, epoxy FR4).
300
350
400
450
500
550
600
0
5
10
15
20
25
30
35
40
45
50
S(mm2)
Rth(j-a)
Fig. 6:
versus copper surface under each lead (printed
circuit board, epoxy FR4)..
Thermal resistance junction to ambient
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