參數(shù)資料
型號(hào): STD1NC70Z
廠商: 意法半導(dǎo)體
英文描述: N-CHANNEL 700V - 7.3ohm - 1.4A TO-220/FP/DPAK/IPAK Zener-Protected PowerMESH⑩III MOSFET
中文描述: N溝道高達(dá)700V - 7.3ohm - 1.4A的TO-220/FP/DPAK/IPAK齊保護(hù)的PowerMESH⑩三MOSFET的
文件頁(yè)數(shù): 2/13頁(yè)
文件大?。?/td> 634K
代理商: STD1NC70Z
STP2NC70Z, STP2NC70ZFP, STD1NC70Z, STD1NC70Z-1
2/13
ABSOLUTE MAXIMUM RATINGS
Symbol
(
l
) Pulse width limited by safe operating area
(1) I
SD
10A, di/dt
200A/μs, V
DD
V
(BR)DSS
, T
j
T
JMAX.
(*) Limited only by maximum temperature allowed
THERMAL DATA
AVALANCHE CHARACTERISTICS
Symbol
I
AR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
j
max)
E
AS
Single Pulse Avalanche Energy
(starting T
j
= 25 °C, I
D
= I
AR
, V
DD
= 50 V)
GATE-SOURCE ZENER DIODE
Symbol
BV
GSO
Gate-Source Breakdown
Voltage
α
T
Voltage Thermal Coefficient
Note: 3.
V
BV
=
α
T (25°-T) BV
GSO
(25°)
(#) When mounted on minimum Footprint
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES
The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s
ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be
applied from gate to souce. In this respect the Zener voltage is appropriate to achieve an efficient and cost-
effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the usage
of external components.
Parameter
Value
Unit
STP2NC70Z
STP2NC70ZFP
STD1NC70Z
STD1NC70Z-1
V
DS
V
DGR
V
GS
I
D
I
D
I
DM
(
l
)
P
TOT
Drain-source Voltage (V
GS
= 0)
Drain-gate Voltage (R
GS
= 20 k
)
700
V
700
V
Gate- source Voltage
± 25
V
Drain Current (continuos) at T
C
= 25°C
Drain Current (continuos) at T
C
= 100°C
1.4
1.4 (*)
1.4
A
0.9
0.9 (*)
0.9
A
Drain Current (pulsed)
5.6
5.6 (*)
5.6
A
Total Dissipation at T
C
= 25°C
Derating Factor
50
25
45
W
0.4
0.2
0.36
W/°C
I
GS
Gate-source Current (DC)
± 50
mA
V
ESD(G-S)
dv/dt (1)
V
ISO
T
j
T
stg
Gate source ESD(HBM-C=100pF, R=1.5K
)
Peak Diode Recovery voltage slope
2000
V
3
V/ns
Insulation Withstand Voltage (DC)
-
2500
-
V
Operating Junction Temperature
Storage Temperature
-65 to 150
-65 to 150
°C
°C
TO-220
TO-220FP
DPAK
IPAK
2.75
100
100
Rthj-case
Rthj-pcb
Rthj-amb
T
l
Thermal Resistance Junction-case Max
Thermal Resistance Junction-pcb Max (for SMD) (#)
Thermal Resistance Junction-ambient Max
2.5
5
°C/W
°C/W
°C/W
°C
62.5
300
Maximum Lead Temperature For Soldering Purpose
275
Parameter
Max Value
1.4
Unit
A
60
mJ
Parameter
Test Conditions
Igs=± 1mA (Open Drain)
Min.
25
Typ.
Max.
Unit
V
T=25°C Note(3)
1.3
10
-4
/°C
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