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參數(shù)資料
| 型號(hào)： | STBR608 |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | 50-60Hz RECTIFICATION BRIDGE |
| 中文描述： | 50 - 60赫茲整流橋 |
| 文件頁(yè)數(shù)： | 2/4頁(yè) |
| 文件大?。?/td> | 57K |
| 代理商： | STBR608 |
STBR606/608
2/5
Symbol
R
th(j-c)
R
th(j-a)
Parameter
Min.
Typ.
7.4
Max.
8
Unit
°C/W
Junction to case
Junction to ambient
35
°C/W
THERMAL PARAMETERS
Symbol
V
F
I
R
Parameter
Test conditions
Min.
Typ.
Max.
1.05
Unit
V
μ
A
μ
A
pF
Forward voltage drop
I
F
= 6A
V
R
= V
RRM
Reverse leakage current per
leg
Tj = 25°C
5
Tj = 125°C
50
C
Junction capacitance per leg
(note 1)
55
Note 1
: Measured at 1MHz and applied reverse voltage of 4V.
ELECTRICAL CHARACTERISTICS
0
1
2
3
4
5
6
7
8
9
10
11
12
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
IF(av)(A)
IP / IF(av)=20
IP / IF(av)=10
IP / IF(av)=5
(capacitive load)
IP / IF(av)=P
(resistive load)
PF(av)(W)
Fig. 1:
Average power dissipation of bridge versus
average output current.
0
1
2
3
4
5
6
7
0
25
50
75
100
125
150
Tamb(°C)
Rth(j-a)=Rth(j-c)
Rth(j-a)=15°C/W
Rth(j-a)=35°C/W
IF(av)(A)
Fig. 2:
Average output current versus ambient
temperature (resistive load or inductive load)
0.1
1.0
10.0
100.0
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
tp(s)
Free air
Zth(j-a)(°C/W)
Fig. 3:
Variation of thermal impedance junction to
ambient versus pulse duration (printed circuit
board epoxy FR4)
0.1
1.0
10.0
100.0
1000.0
0.0
0.5
1.0
1.5
2.0
2.5
VFM(V)
Tj=25°C
Tj=125°C
IFM(A)
Fig. 4:
Forward voltage drop versus forward
current (typical values, per leg).
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