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參數(shù)資料
| 型號(hào)： | ST1336 |
| 廠(chǎng)商： | 意法半導(dǎo)體 |
| 英文描述： | Memory Micromodules General Information for D1, D2 and C Packaging |
| 中文描述： | 一般資料記憶體微型模塊包裝為D1，D2級(jí)和C |
| 文件頁(yè)數(shù)： | 1/13頁(yè) |
| 文件大?。?/td> | 277K |
| 代理商： | ST1336 |
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1/13
December 1999
D10, D15, D20, D22, C20, C30
MICROMODULES
Memory Micromodules
General Information for D1, D2 and C Packaging
I
Micromodules were developed specifically for
embedding in Smartcards and Memory Cards
I
The Micromodule provides:
– Support for the chip
– Electrical contacts
– Suitable embedding interface for gluing the
module to the plastic package
I
Physical dimensions and contact positions
compliant to the ISO 7816 standard
I
Micromodules delivered as a continuous Super
35 mm tape. (This differs from the standard
35 mm tape in the spacing distance between
the indexing holes.)
DESCRIPTION
Memory Cards consist of two main parts: the
plastic card, and the embedded Micromodule
(which, in turn, carries the silicon chip).
The plastic card is made of PVC, ABS or similar
material, and can be over-printed with graphics,
text, and magnetic strips. The Micromodule is
embedded in a cavity in the plastic card.
The Micromodules are mounted on Super 35 mm
metallized epoxy tape, and are delivered on reels.
These contain all of the chips from a number of
wafers, includingthosechips that were found to be
non-functioning during testing. Traceability is
ensured by a label fixed on the reel.
D10
D20
1
1
1
1
1
1
1
1
potting side
contact side
D15
D22
C30
C20
Table 1. Memory Card and Memory Tag Integrated Circuits
Module
Please see the data briefing sheets of these products for example illustrations of these
micromodules
D10
ST1200, ST1305B, ST1331, ST1333, ST1335, ST1336, ST1353, ST1355
D15
ST14C02, ST1305B, ST1335, ST1336, ST1355
D20
ST14C02, M14C04, M14C16, M14C32
D22
M14C64, M14128, M14256
C30
M35101, M35102
C20
M35101, M35102
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ST14C02C | Memory Micromodules General Information for D1, D2 and C Packaging |
| ST1336-BD10 | 5-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms |
| ST1336-BD15 | 5-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms |
| ST1336-BW2 | 5-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms |
| ST1336-BW4 | 5-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ST1336-BD10 | 制造商:STMICROELECTRONICS 制造商全稱(chēng):STMicroelectronics 功能描述:5-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms |
| ST1336-BD10/XXYY | 制造商:STMICROELECTRONICS 制造商全稱(chēng):STMicroelectronics 功能描述:EEPROM |
| ST1336-BD15 | 制造商:STMICROELECTRONICS 制造商全稱(chēng):STMicroelectronics 功能描述:5-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms |
| ST1336-BD15/XXYY | 制造商:STMICROELECTRONICS 制造商全稱(chēng):STMicroelectronics 功能描述:EEPROM |
| ST1336-BW2 | 制造商:STMICROELECTRONICS 制造商全稱(chēng):STMicroelectronics 功能描述:5-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms |
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