參數(shù)資料
型號： SST55LD019A-45-C-TQP
廠商： SILICON STORAGE TECHNOLOGY INC
元件分類： 存儲控制器/管理單元
英文描述： FLASH MEMORY DRIVE CONTROLLER, PQFP64
封裝： MS-026ADC, TQFP-64
文件頁數(shù)： 59/76頁
文件大?。?/td> 711K
代理商： SST55LD019A-45-C-TQP
62
Advance Information
ATA Flash Disk Controller
SST55LD019A / SST55LD019B / SST55LD019C
2004 Silicon Storage Technology, Inc.
S71241-02-000
4/04
12.0 ELECTRICAL SPECIFICATIONS
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
D.C. Voltage on Pins1 I3, I4, O4, and O5 to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD+0.5V
1. Please refer to Table 3-1 for pin assignment information.
Transient Voltage (<20 ns) on Pins1 I3, I4, O4, and O5 to Ground Potential . . . . . . . . . . . . . . . . . -2.0V to VDD+2.0V
D.C. Voltage on Pins1 I1, I2, O1, O2, and O6 to Ground Potential. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDDQ+0.5V
Transient Voltage (<20 ns) on Pins1 I1, I2, O1, O2, and O6 to Ground Potential. . . . . . . . . . . . . -2.0V to VDDQ+2.0V
Package Power Dissipation Capability (Ta = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W
Through Hole Lead Soldering Temperature (10 Seconds). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
Surface Mount Lead Soldering Temperature (3 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C
Output Short Circuit Current2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
2. Outputs shorted for no more than one second. No more than one output shorted at a time.
TABLE
12-1: ABSOLUTE MAXIMUM POWER PIN STRESS RATINGS
Parameter
Symbol
Conditions
Input Power
VDDQ
VDD
-0.3V min to 6.5V max
-0.3V min to 4.0V max
Voltage on any flash media interface pin with respect to VSS
-0.5V min to VDD + 0.5V max
Voltage on all other pins with respect to VSS
-0.5V min to VDDQ + 0.5V max
T12-1.0 1241
OPERATING RANGE
Range
Ambient Temperature
VDD
VDDQ
Commercial
0°C to +70°C
3.165-3.465V
4.5-5.5V; 3.165-3.465V
Industrial
-40°C to +85°C
3.165-3.465V
4.75-5.25V; 3.165-3.465V
AC CONDITIONS OF TEST
Input Rise/Fall Time . . . . . . . . . . . . . . 10 ns
Output Load . . . . . . . . . . . . . . . . . . . . CL = 100 pF
Note: All AC specifications are guaranteed by design.
TABLE
12-2: RECOMMENDED SYSTEM POWER-ON TIMING
Symbol
Parameter
Typical
Maximum
Units
TPU-INITIAL
Drive Initialization to Ready
0.5
1.5
sec/MB
TPU-READY11
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
SST55LD019A/B:
Host Power-on/Reset to Ready Operation
200
500
ms
TPU-WRITE11
Host Power-on/Reset to Write Operation
200
500
ms
TPU-READY21
SST55LD019C:
Host Power-on/Reset to Ready Operation
400
1000
ms
TPU-WRITE21
Host Power-on/Reset to Write Operation
400
1000
ms
T12-2.0 1241
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