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參數(shù)資料
| 型號(hào)： | SSP-21116-010-B |
| 廠商： | DATA DEVICE CORP |
| 元件分類： | 模擬信號(hào)調(diào)理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, DMA16 |
| 封裝： | DIP-16 |
| 文件頁數(shù)： | 8/12頁 |
| 文件大?。?/td> | 185K |
| 代理商： | SSP-21116-010-B |
5
Data Device Corporation
www.ddc-web.com
SSP-21116
J-03/03-0
While the SSPC will always turn off in less than 25 s when the
load current is greater than 1200%, the actual current may
“spike” to a value higher than 1200% due to circuit delays. The
MOSFET's inherently self limit the maximum current, depending
on the number of MOSFET's and their rating.
During turn on and turn off the rise and fall time of the output volt-
age is controlled to be less than 200
s. This value is a compro-
mise between faster response time with a greater amount of RFI
and EMI generated, and slower response time with less RFI and
EMI but greater power dissipated in the SSPC during transitions.
Since the Power MOSFET switches are not saturated during
transitions the switching power dissipation is much greater than
the static dissipation, and longer transitions result in a larger
temperature rise. If the SSPC is rapidly turned on and off, the
high average dissipation could result in a significant temperature
rise in the SSPC. For this reason do not turn the SSPC off and
on more rapidly than 30 msec. This will limit the maximum tem-
perature of the switches to a safe level.
The SSP-21116 has been designed to derive its internal power
requirements from the bias supply input (+5 Vdc).
APPLICATIONS INFORMATION
SELECTION
The selection of a proper sized SSPC is essential for protection
of the wire and load. This selection should be based on the
steady state and transient overload currents.
The shape of the trip curve (I
2T) is selected as optimum to pro-
tect the system wiring. The power dissipated in the wire is the
wire resistance times the load current squared, and the temper-
ature of the wire is determined by the length of time that this
power is being dissipated. This makes the wire temperature pro-
portional to the current squared times the on time. Since the trip
curve follows this same characteristic the SSPC can accurately
predict the wire temperature rise as a result of overloads and
remove load current before the wiring is damaged from overtem-
perature. Of course, the wire I
2T product should be greater than
the SSPC I
2T product for the SSPC to protect the wire.
PRECAUTIONS
When a short circuit causes turn off of the SSPC, precautions
have to be taken to limit the transient voltages generated by the
wire inductance. The magnitude of this voltage is L*di/dt where
CONTROL INPUT
LOAD CURRENT
TRIP POINT
STATUS 2
STATUS 1
T1
T2 T3 T4 T5
T6
T7
T8 T9
T10
T11 T12
T13
SOLID-STATE POWER CONTROLLER TIMING AT 28 Vdc.
TIME
DESCRIPTION
MAXIMUM
UNIT
NOTES
T1-T2
TURN-ON DELAY
350
s
T2-T3
CURRENT RISE TIME
200
s
T1-T4
STATUS 1 & STATUS 2 TURN-ON DELAY
7.5
ms
T4-T5
STATUS 1 & STATUS 2 RISE AND FALL TIME
350
ns
T6-T7
TURN-OFF DELAY
350
s
T7-T8
CURRENT FALL TIME
200
s
T6-T9
STATUS 1 & STATUS 2 TURN-OFF DELAY
5.0
ms
T10-T11
TRIP TIME AFTER TURN-ON
SEE FIG. 2
s
T11-T12
CURRENT FALL TIME AFTER TRIP
200
s
LOAD CURRENT < 800%
T11-T12
CURRENT FALL TIME AFTER TRIP
25
s
LOAD CURRENT > 1200%
T11-T13
TRIP TURN-OFF STATUS 1 DELAY
5.0
ms
FIGURE 3. SOLID-STATE POWER CONTROLLER TIMING
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