
SSM2804
Rev. 0 | Page 7 of 36
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4.
Parameter
Rating
Analog Supply Voltage (AVDD)
0.3 V to +3.6 V
Speaker Supply Voltage (PVDD)
0.3 V to +3.6 V
Input Voltage
VDD
SD, SCL, SDA, RCV+, RCV
0.3 V to +6.0 V
INA1, INA2, INB1, INB2, INC1, INC2
0.3 V to AVDD + 0.3 V
ESD (HBM) on Headphone Output
8 kV
Storage Temperature Range
65°C to +150°C
Operating Temperature Range
40°C to +85°C
Junction Temperature Range
65°C to +165°C
Lead Temperature (Soldering, 60 sec)
300°C
Table 5. Thermal Resistance
Package Type
PCB
θJA
θJB
Unit
30-Ball, 2.5 mm × 3.0 mm WLCSP
1S0P
162
39
°C/W
2S0P
76
21
°C/W
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.