- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄16828 > SSM2315-EVALZ (Analog Devices Inc)BOARD EVAL SSM2315 PDF資料下載
參數(shù)資料
| 型號： | SSM2315-EVALZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 5/16頁 |
| 文件大?。?/td> | 0K |
| 描述： | BOARD EVAL SSM2315 |
| 標準包裝： | 1 |
| 放大器類型： | D 類 |
| 輸出類型： | 1-通道（單聲道） |
| 在某負載時最大輸出功率 x 通道數(shù)量： | 4.28W x 1 @ 3 歐姆 |
| 電源電壓： | 2.5 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 板類型： | 完全填充 |
| 已用 IC / 零件： | SSM2315 |
| 已供物品： | 板 |
| 產(chǎn)品目錄頁面： | 764 (CN2011-ZH PDF) |
| 相關產(chǎn)品： | SSM2315CBZ-REEL7DKR-ND - IC AMP AUDIO 4.28W MONO D 9WLCSP SSM2315CBZ-REEL7CT-ND - IC AMP AUDIO 4.28W MONO D 9WLCSP SSM2315CBZ-REEL7TR-ND - IC AMP AUDIO 4.28W MONO D 9WLCSP |
SSM2315
Rev. A | Page 13 of 16
LAYOUT
As output power continues to increase, care must be taken to lay
out PCB traces and wires properly among the amplifier, load,
and power supply. A good practice is to use short, wide PCB
tracks to decrease voltage drops and to minimize inductance.
Ensure that track widths are at least 200 mil for every inch of track
length for lowest DCR, and use 1 oz or 2 oz of copper PCB traces
to further reduce IR drops and inductance. A poor layout increases
voltage drops, consequently affecting efficiency. Use large traces
for the power supply inputs and amplifier outputs to minimize
losses due to parasitic trace resistance.
Proper grounding guidelines help improve audio performance,
minimize crosstalk between channels, and prevent switching noise
from coupling into the audio signal. To maintain high output swing
and high peak output power, the PCB traces that connect the
output pins to the load and supply pins should be as wide as
possible to maintain the minimum trace resistances. It is also
recommended that a large ground plane be used for minimum
impedances.
In addition, good PCB layouts isolate critical analog paths from
sources of high interference. High frequency circuits (analog
and digital) should be separated from low frequency circuits.
Properly designed multilayer printed circuit boards can reduce
EMI emission and increase immunity to the RF field by a factor
of 10 or more, compared with double-sided boards. A multilayer
board allows a complete layer to be used for the ground plane,
whereas the ground plane side of a double-sided board is often
disrupted with signal crossover.
If the system has separate analog and digital ground and power
planes, the analog ground plane should be underneath the analog
power plane. Similarly, the digital ground plane should be
underneath the digital power plane. There should be no overlap
between analog and digital ground planes or analog and digital
power planes.
INPUT CAPACITOR SELECTION
The SSM2315 does not require input coupling capacitors if the
input signal is biased from 1.0 V to VDD 1.0 V. Input capacitors are
required if the input signal is not biased within this recommended
input dc common-mode voltage range, if high-pass filtering is
needed, or if a single-ended source is used. If high-pass filtering
is needed at the input, the input capacitor and the input resistor
of the SSM2315 form a high-pass filter whose corner frequency
is determined by the following equation:
fC = 1/(2π × RIN × CIN)
The input capacitor can significantly affect the performance of
the circuit. Not using input capacitors degrades both the output
offset of the amplifier and the dc PSRR performance.
PROPER POWER SUPPLY DECOUPLING
To ensure high efficiency, low total harmonic distortion (THD),
and high PSRR, proper power supply decoupling is necessary.
Noise transients on the power supply lines are short-duration
voltage spikes. Although the actual switching frequency can range
from 10 kHz to 100 kHz, these spikes can contain frequency
components that extend into the hundreds of megahertz. The
power supply input needs to be decoupled with a good quality,
low ESL, low ESR capacitor, usually of around 4.7 μF. This capacitor
bypasses low frequency noises to the ground plane. For high
frequency transients noises, use a 0.1 μF capacitor as close as
possible to the VDD pin of the device. Placing the decoupling
capacitor as close as possible to the SSM2315 helps maintain
efficient performance.
相關PDF資料 |
PDF描述 |
|---|---|
| ECC06DRTH-S93 | CONN EDGECARD 12POS DIP .100 SLD |
| EBC08DRES-S93 | CONN EDGECARD 16POS .100 EYELET |
| SSM2301-MINI-EVALZ | BOARD EVAL MINI SSM2301 |
| V150B15E150B2 | CONVERTER MOD DC/DC 15V 150W |
| 50YXJ22MTA5X11 | CAP ALUM 22UF 50V 20% RADIAL |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| SSM2315-EVALZ1 | 制造商:AD 制造商全稱:Analog Devices 功能描述:Filterless, High Efficiency, Mono 3 W Class-D Audio Amplifier |
| SSM2316GN | 制造商:SSC 制造商全稱:Silicon Standard Corp. 功能描述:N-channel Enhancement-mode Power MOSFET |
| SSM2317 | 制造商:AD 制造商全稱:Analog Devices 功能描述:Filterless High Efficiency Mono 3 W Class-D Audio Amplifier |
| SSM2317CBZ-REEL | 功能描述:IC AMP AUDIO 3.89W MONO D 9WLCSP RoHS:是 類別:集成電路 (IC) >> 線性 - 音頻放大器 系列:- 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,500 系列:DirectDrive® 類型:D 類 輸出類型:1-通道（單聲道），帶立體聲耳機 在某負載時最大輸出功率 x 通道數(shù)量:930mW x 1 @ 8 歐姆; 40mW x 2 @ 16 歐姆 電源電壓:2.7 V ~ 5.5 V 特點:消除爆音，差分輸入，I²C，靜音，關閉，音量控制 安裝類型:表面貼裝 供應商設備封裝:25-WLP（2.09x2.09） 封裝/外殼:25-WFBGA，WLCSP 包裝:帶卷 (TR) 其它名稱:MAX97000EWA+T-ND |
| SSM2317CBZ-REEL7 | 功能描述:IC AMP AUDIO 3.89W MONO D 9WLCSP RoHS:是 類別:集成電路 (IC) >> 線性 - 音頻放大器 系列:- 標準包裝:2,000 系列:- 類型:AB 類 輸出類型:2 通道（立體聲） 在某負載時最大輸出功率 x 通道數(shù)量:- 電源電壓:4 V ~ 18 V 特點:- 安裝類型:通孔 供應商設備封裝:8-DIP 封裝/外殼:8-DIP（0.300"，7.62mm） 包裝:管件 |
發(fā)布緊急采購，3分鐘左右您將得到回復。