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參數(shù)資料
| 型號： | SPI-240-15-T1 |
| 廠商： | Sanyo Electric Co.,Ltd. |
| 英文描述： | Ultraminiature photointerrupter supporting reflow soldering (Darlington-transistor type) |
| 中文描述： | 超小型光電斷路器支持回流焊（達林頓晶體管型） |
| 文件頁數(shù)： | 5/7頁 |
| 文件大?。?/td> | 49K |
| 代理商： | SPI-240-15-T1 |
SPI-240-15-T1
No.6027 5/7
Package dimensions and Pin connection
As stated in the sttached paper. (No.6027 4/7)
Soldering conditions
(1) Reflow soldering
The temperature of the reflow furnace is to be set in accordance with the following temperature profile.
Soldering must be done only one time.
Temperature
: On the topsurface of product
Reflow type
: Hot air
(2) Manusl soldering
Temperature
Time
Clearance
: Max. 290
°
C (Soldering iron tip temperature)
: Max. 3 sec
: Min. 0.5mm from package
(1) Bending a lead should avoid. However, when bending is necessary, take care the next items.
q
Bending a lead must be done before soldering.
w
Bending a lead must be done in the states of fixing leads and no stress for the regin part. Because it is possible that
stress for the regin part cause troubles such as gold wire breaking and so on.
e
A lead must be bend under the stay.
r
Do not bend the same position of leads more than twice.
(2) The hole pitch of a circuit board must fit to the recommended mounting dimension.
(3) Take core the following when soldering.
q
Do not heat a product under any stress (a twist and so on) to leads.
w
Do not heat a product in the states of operating force to the regin part.
(4) Use the flux which contain no chlorine, have no corrosion and do not need washing.
(5) Be careful that flux or other chemicals do not attach to the luminous surface and passive surface.
(6) Precautions of the product after the open dry packing
q
The product after the open dry packing should be stored in the dry packing again.
The product should be kept under the conditions below, if the product is not stored in the dry paking.
Temperature
: 5 to 30
°
C
Humidity
: Max 70%RH
Term
: Max 7days
w
The product to be out the term without dry packing must be practiced baking.
Baking conditions
: +60
±
5
°
C, 10 to 20Hr
(7) The reflow conditions must be confirmed that no problem by your reflow furnace.
PRECAUTIONS
Max 220
°
C
180
°
C
Max 160
°
C
Max 60sec
0.5mm
0.5mm
Max 5sec
Max 40sec
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