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參數(shù)資料
| 型號(hào)： | SPC560B50L3C5E0R |
| 廠商： | STMICROELECTRONICS |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, FLASH, 64 MHz, MICROCONTROLLER, PQFP100 |
| 封裝： | 14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, LQFP-100 |
| 文件頁(yè)數(shù)： | 24/74頁(yè) |
| 文件大?。?/td> | 971K |
| 代理商： | SPC560B50L3C5E0R |
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SPC560Bx, SPC560Cx
Electrical characteristics
Doc ID 14619 Rev 4
4.9
Power management electrical characteristics
4.9.1
Voltage regulator electrical characteristics
The device implements an internal voltage regulator to generate the low voltage core supply
VDD_LV from the high voltage ballast supply VDD_BV. The regulator itself is supplied by the
common I/O supply VDD. The following supplies are involved:
●
HV—High voltage external power supply for voltage regulator module. This must be
provided externally through VDD power pin.
●
BV—High voltage external power supply for internal ballast module. This must be
provided externally through VDD_BV power pin. Voltage values should be aligned with
VDD.
●
LV—Low voltage internal power supply for core, FMPLL and flash digital logic. This is
generated by the internal voltage regulator but provided outside to connect stability
capacitor. It is further split into four main domains to ensure noise isolation between
critical LV modules within the device:
–
LV_COR—Low voltage supply for the core. It is also used to provide supply for
FMPLL through double bonding.
–
LV_CFLA—Low voltage supply for code flash module. It is supplied with dedicated
ballast and shorted to LV_COR through double bonding.
–
LV_DFLA—Low voltage supply for data flash module. It is supplied with dedicated
ballast and shorted to LV_COR through double bonding.
–
LV_PLL—Low voltage supply for FMPLL. It is shorted to LV_COR through double
bonding.
1.
VDD = 3.3 V ± 10% / 5.0 V ± 10%, TA = 40 to 125 °C, unless otherwise specified
2.
All values need to be confirmed during device validation.
3.
This is a transient configuration during power-up, up to the end of reset PHASE2 (refer to RGM module section of the
device reference manual).
4.
CL includes device and package capacitance (CPKG <5 pF).
5.
The configuration PAD3V5 = 1 when VDD = 5 V is only transient configuration during power-up. All pads but RESET and
Nexus output (MDOx, EVTO, MCKO) are configured in input or in high impedance state.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| SPC560B50L3C6E0X | 功能描述:32位微控制器 - MCU 32-BIT Embedded MCU 64 MHz 512kB Body RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT |
| SPC560B50L3C6E0Y | 功能描述:32位微控制器 - MCU 32-BIT Embedded MCU 64 MHz 512kB Body RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT |
| SPC560B50L5C6E0X | 功能描述:32位微控制器 - MCU 32-BIT Embedded MCU 64 MHz 512kB Body RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT |
| SPC560B50L5C6E0Y | 功能描述:32位微控制器 - MCU 32-BIT Embedded MCU 64 MHz 512kB Body RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT |
| SPC560B50SK | 功能描述:開發(fā)板和工具包 - ARM Raisonance Kit 512K Starter Rflasher 64 RoHS:否 制造商:Arduino 產(chǎn)品:Development Boards 工具用于評(píng)估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口類型:DAC, ICSP, JTAG, UART, USB 工作電源電壓:3.3 V |
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