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2
SP507_100_081208
SP507 Multi–Mode Serial Transceiver
Copyright 2008 Exar Corporation
SPECIFICATIONS
T
A = +25°C and VCC = +4.75V to +5.25V unless otherwise noted.
MIN.
TYP.
MAX.
UNITS
CONDITIONS
LOGIC INPUTS
V
IL
0.8
Volts
V
IH
2.0
Volts
LOGIC OUTPUTS
V
OL
0.4
Volts
I
OUT= –3.2mA
V
OH
2.4
Volts
I
OUT= 1.0mA
V.28 DRIVER
DC Parameters
Outputs
Open Circuit Voltage
±15
Volts
per Figure 1
Loaded Voltage
±5.0
±15
Volts
per Figure 2
Short-Circuit Current
±100
mA
per Figure 4
Power-Off Impedance
300
per Figure 5
AC Parameters
V
CC = +5V for AC parameters
Outputs
Transition Time
1.5
s
per Figure 6; +3V to -3V
Instantaneous Slew Rate
30
V/
s
per Figure 3
Propagation Delay
t
PHL
0.5
1
5
s
t
PLH
0.5
1
5
s
Max.Transmission Rate
120
230
kbps
V.28 RECEIVER
DC Parameters
Inputs
Input Impedance
3
7
k
per Figure 7
Open-Circuit Bias
+2.0
Volts
per Figure 8
HIGH Threshold
1.7
3.0
Volts
LOW Threshold
0.8
1.2
Volts
AC Parameters
V
CC = +5V for AC parameters
Propagation Delay
t
PHL
50
100
500
ns
t
PLH
50
100
500
ns
ABSOLUTE MAXIMUM RATINGS
These are stress ratings only and functional operation
of the device at these ratings or any other above those
indicated in the operation sections of the specifications
below is not implied. Exposure to absolute maximum
rating conditions for extended periods of time may
affect reliability.
V
CC............................................................................+7V
Input Voltages:
Logic...............................-0.3V to (V
CC+0.5V)
Drivers............................-0.3V to (V
CC+0.5V)
Receivers........................................±15.5V
Output Voltages:
Logic................................-0.3V to (V
CC+0.5V)
Drivers................................................±15V
Receivers........................-0.3V to (V
CC+0.5V)
Storage Temperature..........................-65°C to +150°C
Power Dissipation per package
80-pin QFP (derate 18.3mW/°C above +70°C)..1500mW
STORAGE CONSIDERATIONS
Due to the relatively large package size of the 80-pin
quad flat-pack, storage in a low humidity environment
is preferred. Large high density plastic packages are
moisture sensitive and should be stored in Dry Vapor
Barrier Bags. Prior to usage, the parts should remain
bagged and stored below 40°C and 60%RH. If the parts
are removed from the bag, they should be used within
48 hours or stored in an environment at or below 20%RH.
If the above conditions cannot be followed, the parts
should be baked for four hours at 125°C in order
remove moisture prior to soldering. Exar ships the 80-
pin LQFP in Dry Vapor Barrier Bags with a humidity
indicator card and desiccant pack. The humidity indicator
should be below 30%RH.