- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄383826 > SOT158-1 (NXP Semiconductors N.V.) Package outline PDF資料下載
參數(shù)資料
| 型號： | SOT158-1 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Package outline |
| 中文描述： | 封裝外形 |
| 文件頁數(shù)： | 1/1頁 |
| 文件大小： | 14K |
| 代理商： | SOT158-1 |
PDF: 1999 Apr 16
Philips Semiconductors
Package outline
UNIT
A
1
A
2
A
3
b
p
c
D
(1)
E
(2)
Z
(1)
e
H
E
L
L
p
Q
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
0.3
0.1
2.45
2.25
0.25
0.42
0.30
0.22
0.14
15.6
15.2
7.6
7.5
0.762
2.25
12.3
11.8
1.15
1.05
0.6
0.3
7
0
o
o
0.1
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.4 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
1.7
1.5
SOT158-1
92-11-17
95-01-24
X
w
M
θ
A
A
1
A
2
b
p
D
H
E
L
p
L
Q
detail X
E
Z
e
c
v
M
A
(A )
3
A
y
40
20
21
1
pin 1 index
0.012
0.004
0.096
0.089
0.017
0.012
0.0087
0.0055
0.61
0.60
0.30
0.29
0.03
0.089
0.48
0.46
0.045
0.041
0.024
0.012
0.004
0.2
0.008
0.004
0.067
0.059
0.010
0
5
10 mm
scale
VSO40: plastic very small outline package; 40 leads
SOT158-1
A
max.
2.70
0.11
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| SOT343N | Plastic surface mounted package; 4 leads |
| SOT389-1 | Plastic Low Profile Quad flat Package |
| SP-2620 | SIGNAL PROCESSING EXCELLENCE |
| SP-2622 | SIGNAL PROCESSING EXCELLENCE |
| SP-2625 | SIGNAL PROCESSING EXCELLENCE |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SOT187-2 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Philips Semiconductors |
| SOT223 | 制造商:DIODES 制造商全稱:Diodes Incorporated 功能描述:SUGGESTED PAD LAYOUT |
| SOT-223 | 制造商:BOURNS 制造商全稱:Bourns Electronic Solutions 功能描述:4-Pin Plastic Small Outline Surface Mount |
| SOT223-3EV-VREG | 功能描述:電源管理IC開發(fā)工具 Voltage Regulator Eval Board RoHS:否 制造商:Maxim Integrated 產(chǎn)品:Evaluation Kits 類型:Battery Management 工具用于評估:MAX17710GB 輸入電壓: 輸出電壓:1.8 V |
發(fā)布緊急采購，3分鐘左右您將得到回復。