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參數(shù)資料
| 型號： | SOT158-1 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Package outline |
| 中文描述： | 封裝外形 |
| 文件頁數(shù)： | 1/1頁 |
| 文件大小： | 14K |
| 代理商： | SOT158-1 |
PDF: 1999 Apr 16
Philips Semiconductors
Package outline
UNIT
A
1
A
2
A
3
b
p
c
D
(1)
E
(2)
Z
(1)
e
H
E
L
L
p
Q
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
0.3
0.1
2.45
2.25
0.25
0.42
0.30
0.22
0.14
15.6
15.2
7.6
7.5
0.762
2.25
12.3
11.8
1.15
1.05
0.6
0.3
7
0
o
o
0.1
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.4 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
1.7
1.5
SOT158-1
92-11-17
95-01-24
X
w
M
θ
A
A
1
A
2
b
p
D
H
E
L
p
L
Q
detail X
E
Z
e
c
v
M
A
(A )
3
A
y
40
20
21
1
pin 1 index
0.012
0.004
0.096
0.089
0.017
0.012
0.0087
0.0055
0.61
0.60
0.30
0.29
0.03
0.089
0.48
0.46
0.045
0.041
0.024
0.012
0.004
0.2
0.008
0.004
0.067
0.059
0.010
0
5
10 mm
scale
VSO40: plastic very small outline package; 40 leads
SOT158-1
A
max.
2.70
0.11
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| SOT187-2 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Philips Semiconductors |
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