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參數(shù)資料
| 型號(hào)： | SOIC24 |
| 廠商： | Fairchild Semiconductor Corporation |
| 英文描述： | 24-Lead Small Outline IC (SOIC) 0.300 Body Width |
| 中文描述： | 24引腳小外形集成電路（SOIC封裝）0.300身寬 |
| 文件頁(yè)數(shù)： | 1/1頁(yè) |
| 文件大?。?/td> | 209K |
| 代理商： | SOIC24 |
January 2001, Rev. A
2001 Fairchild Semiconductor Corporation
24-Lead Small Outline IC (SOIC)
0.300" Body Width
24-Lead Small Outline IC (SOIC) 0.300" Body Width
Package Dimensions
24
13
1
12
A
A1
B
C
D
.093
.004
.013
.009
.599
.104
.012
.020
.013
.614
2.35
0.10
0.33
0.23
15.20
2.65
0.30
0.51
0.32
15.60
Symbol
Inches
Min.
Max.
Min.
Max.
Millimeters
Notes
E
e
H
h
L
N
α
ccc
.290
.299
7.36
7.60
.394
.010
.016
.419
.020
.050
10.00
0.25
0.40
10.65
0.51
1.27
.050 BSC
1.27 BSC
0
°
—
8
°
0
°
—
8
°
3
6
5
2
2
24
24
.004
0.10
Notes:
1.
2.
"D" and "E" do not include mold flash. Mold flash or
protrusions shall not exceed .010 inch (0.25mm).
"L" is the length of terminal for soldering to a substrate.
Terminal numbers are shown for reference only.
"C" dimension does not include solder finish thickness.
Symbol "N" is the maximum number of terminals.
3.
4.
5.
6.
Dimensioning and tolerancing per ANSI Y14.5M-1982.
H
E
A
D
e
B
A1
– C –
LEAD COPLANARITY
ccc C
SEATING
PLANE
α
h x 45
°
L
C
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