參數(shù)資料
型號: SNJ54HCT14WR
廠商: TEXAS INSTRUMENTS INC
元件分類: 門電路
英文描述: HCT SERIES, HEX 1-INPUT INVERT GATE, CDFP14
封裝: CERAMIC, DFP-14
文件頁數(shù): 19/21頁
文件大小: 784K
代理商: SNJ54HCT14WR
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2010
Addendum-Page 2
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
SN74HCT14DTE4
ACTIVE
SOIC
D
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HCT14DTG4
ACTIVE
SOIC
D
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HCT14N
ACTIVE
PDIP
N
14
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
SN74HCT14NE4
ACTIVE
PDIP
N
14
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
SN74HCT14PWLE
OBSOLETE
TSSOP
PW
14
TBD
Call TI
SN74HCT14PWR
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HCT14PWRE4
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HCT14PWRG4
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HCT14PWT
ACTIVE
TSSOP
PW
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HCT14PWTE4
ACTIVE
TSSOP
PW
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HCT14PWTG4
ACTIVE
TSSOP
PW
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SNJ54HCT14FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
SNJ54HCT14J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
SNJ54HCT14W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
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