參數資料
型號: SN74LVC2G17YEPR
廠商: TEXAS INSTRUMENTS INC
元件分類: 門電路
英文描述: LVC/LCX/Z SERIES, DUAL 1-INPUT NON-INVERT GATE, BGA6
封裝: DSBGA-6
文件頁數: 13/15頁
文件大?。?/td> 422K
代理商: SN74LVC2G17YEPR
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
SN74LVC2G17DBVR
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC2G17DBVRE4
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC2G17DBVT
ACTIVE
SOT-23
DBV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC2G17DBVTE4
ACTIVE
SOT-23
DBV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC2G17DCKR
ACTIVE
SC70
DCK
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC2G17DCKRE4
ACTIVE
SC70
DCK
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC2G17DCKRG4
ACTIVE
SC70
DCK
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC2G17DCKT
ACTIVE
SC70
DCK
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC2G17DCKTE4
ACTIVE
SC70
DCK
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC2G17YEAR
NRND
WCSP
YEA
6
3000
TBD
SNPB
Level-1-260C-UNLIM
SN74LVC2G17YEPR
NRND
WCSP
YEP
6
3000
TBD
SNPB
Level-1-260C-UNLIM
SN74LVC2G17YZAR
NRND
WCSP
YZA
6
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
SN74LVC2G17YZPR
ACTIVE
WCSP
YZP
6
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
Addendum-Page 1
相關PDF資料
PDF描述
SN74LVC2G240YZAR LVC/LCX/Z SERIES, DUAL 1-BIT DRIVER, INVERTED OUTPUT, PBGA8
SN74LVC2G241YEPR LVC/LCX/Z SERIES, DUAL 1-BIT DRIVER, TRUE OUTPUT, BGA8
SN74LVC2G241YEAR LVC/LCX/Z SERIES, DUAL 1-BIT DRIVER, TRUE OUTPUT, BGA8
SN74LVC2G32YEAR LVC/LCX/Z SERIES, DUAL 2-INPUT OR GATE, BGA8
SN74LVC2G34DBVRE4 LVC/LCX/Z SERIES, DUAL 1-INPUT NON-INVERT GATE, PDSO6
相關代理商/技術參數
參數描述
SN74LVC2G17YZAR 功能描述:IS BUFF DL SCHMIT TRIG 6DSBGA RoHS:是 類別:集成電路 (IC) >> 邏輯 - 緩沖器,驅動器,接收器,收發(fā)器 系列:74LVC 標準包裝:1,000 系列:74ABT 邏輯類型:寄存收發(fā)器,非反相 元件數:1 每個元件的位元數:8 輸出電流高,低:32mA,64mA 電源電壓:4.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:24-SOIC(0.295",7.50mm 寬) 供應商設備封裝:24-SOIC 包裝:帶卷 (TR)
SN74LVC2G17YZPR 功能描述:緩沖器和線路驅動器 Dual Schmtt Trggr Bffr RoHS:否 制造商:Micrel 輸入線路數量:1 輸出線路數量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel
SN74LVC2G240DCT3 制造商:Rochester Electronics LLC 功能描述: 制造商:Texas Instruments 功能描述:
SN74LVC2G240DCTR 功能描述:緩沖器和線路驅動器 Dual Buffer/Driver RoHS:否 制造商:Micrel 輸入線路數量:1 輸出線路數量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel
SN74LVC2G240DCUR 功能描述:緩沖器和線路驅動器 Tri-State Dual RoHS:否 制造商:Micrel 輸入線路數量:1 輸出線路數量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel