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| 型號(hào)： | SN74LVC125AIPWREP |
| 廠(chǎng)商： | Texas Instruments |
| 文件頁(yè)數(shù)： | 11/14頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC BUS BUFF TRI-ST QD 14TSSOP |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | 74LVC |
| 邏輯類(lèi)型： | 緩沖器/線(xiàn)路驅(qū)動(dòng)器，非反相 |
| 元件數(shù)： | 4 |
| 每個(gè)元件的位元數(shù)： | 1 |
| 輸出電流高，低： | 24mA，24mA |
| 電源電壓： | 1.65 V ~ 3.6 V |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類(lèi)型： | 表面貼裝 |
| 封裝/外殼： | 14-TSSOP（0.173"，4.40mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 14-TSSOP |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 產(chǎn)品目錄頁(yè)面： | 991 (CN2011-ZH PDF) |
| 其它名稱(chēng)： | 296-22333-6 |
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PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
Op Temp (°C)
Top-Side Markings
(4)
Samples
SN74LVC125AIPWREP
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C125AEP
SN74LVC125AMDREP
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
125AMEP
V62/04656-01XE
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C125AEP
V62/04656-02YE
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
125AMEP
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SN74LVC125AMDREP | 功能描述:緩沖器和線(xiàn)路驅(qū)動(dòng)器 Mil Enhance Quad Bus Buffer Gate RoHS:否 制造商:Micrel 輸入線(xiàn)路數(shù)量:1 輸出線(xiàn)路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| SN74LVC125ANS | 制造商:Texas Instruments 功能描述:IC, 74 series logic |
| SN74LVC125ANSR | 功能描述:緩沖器和線(xiàn)路驅(qū)動(dòng)器 Tri-State Quad Bus RoHS:否 制造商:Micrel 輸入線(xiàn)路數(shù)量:1 輸出線(xiàn)路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| SN74LVC125ANSRE4 | 功能描述:緩沖器和線(xiàn)路驅(qū)動(dòng)器 Quad Bus Buffer Gate With 3-State Outputs RoHS:否 制造商:Micrel 輸入線(xiàn)路數(shù)量:1 輸出線(xiàn)路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| SN74LVC125ANSRG4 | 功能描述:緩沖器和線(xiàn)路驅(qū)動(dòng)器 Quad Bus Bufer Gate RoHS:否 制造商:Micrel 輸入線(xiàn)路數(shù)量:1 輸出線(xiàn)路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
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