參數(shù)資料
型號: SN74LVC07ADTE4
廠商: TEXAS INSTRUMENTS INC
元件分類: 門電路
英文描述: LVC/LCX/Z SERIES, HEX 1-INPUT NON-INVERT GATE, PDSO14
封裝: GREEN, PLASTIC, MS-012AB, SOIC-14
文件頁數(shù): 12/23頁
文件大?。?/td> 842K
代理商: SN74LVC07ADTE4
A
Y
SCAS595T
– OCTOBER 1997 – REVISED FEBRUARY 2011
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
FUNCTION TABLE
(EACH BUFFER/DRIVER)
INPUT
OUTPUT
A
Y
H
L
LOGIC DIAGRAM, EACH BUFFER/DRIVER (POSITIVE LOGIC)
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage range
–0.5
6.5
V
VI
Input voltage range(2)
–0.5
6.5
V
VO
Output voltage range
–0.5
6.5
V
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
Continuous current through VCC or GND
±100
mA
Tstg
Storage temperature range
–65
150
°C
(1)
Stresses beyond those listed under
"absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
"recommended operating
conditions
" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
THERMAL INFORMATION
SN74LVC07A
THERMAL METRIC(1)
(14) PINS
UNITS
D
DB
DGV
NS
PW
RGY
θJA
Junction-to-ambient thermal resistance
120.8
135.1
157.7
120.3
151.5
79.4
θJCtop
Junction-to-case (top) thermal resistance
79.7
86.7
78.3
76.3
77.6
95.7
θJB
Junction-to-board thermal resistance
75.1
82.4
90.8
79
92.3
55.4
°C/W
ψJT
Junction-to-top characterization parameter
37.2
43.7
21
36.2
21
16.4
ψJB
Junction-to-board characterization parameter
74.8
81.9
90.1
78.7
92.7
55.6
θJCbot
Junction-to-case (bottom) thermal resistance
n/a
34.8
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
1997–2011, Texas Instruments Incorporated
Product Folder Link(s): SN74LVC07A
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