參數(shù)資料
型號: SN74AVCH4T245DE4
廠商: Texas Instruments
文件頁數(shù): 18/24頁
文件大?。?/td> 0K
描述: IC BUS TRANSCVR 4BIT 16SOIC
標準包裝: 40
系列: 74AVCH
邏輯功能: 變換器,雙向,3 態(tài)
位數(shù): 2
輸入類型: 邏輯
輸出類型: 邏輯
數(shù)據(jù)速率: 380Mbps
通道數(shù): 1
輸出/通道數(shù)目: 2
差分 - 輸入:輸出: 無/無
傳輸延遲(最大): 2.9ns
電源電壓: 1.2 V ~ 3.6 V
工作溫度: -40°C ~ 85°C
封裝/外殼: 16-SOIC(0.154",3.90mm 寬)
供應商設備封裝: 16-SOIC N
包裝: 管件
www.ti.com
Absolute Maximum Ratings
(1)
4-BIT DUAL-SUPPLY BUS TRANSCEIVER
WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS
SCES577D – JUNE 2004 – REVISED JUNE 2007
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCCA
Supply voltage range
–0.5
4.6
V
VCCB
I/O ports (A port)
–0.5
4.6
VI
Input voltage range(2)
I/O ports (B port)
–0.5
4.6
V
Control inputs
–0.5
4.6
A port
–0.5
4.6
Voltage range applied to any output
VO
V
in the high-impedance or power-off state(2)
B port
–0.5
4.6
A port
–0.5 VCCA + 0.5
VO
Voltage range applied to any output in the high or low state(2)(3)
V
B port
–0.5 VCCB + 0.5
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
Continuous current through VCCA, VCCB, or GND
±100
mA
D package(4)
73
DGV package(4)
120
θJA
Package thermal impedance
PW package(4)
108
°C/W
RGY package(5)
39
RSV package
184
Tstg
Storage temperature range
–65
150
°C
(1)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The input voltage and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3)
The output positive-voltage rating may be exceeded up to 4.6 V maximum if the output current rating is observed.
(4)
The package thermal impedance is calculated in accordance with JESD 51-7.
(5)
The package thermal impedance is calculated in accordance with JESD 51-5.
3
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