參數(shù)資料
型號: SN74ABT8952DWRG4
廠商: Texas Instruments
文件頁數(shù): 11/31頁
文件大?。?/td> 0K
描述: IC SCAN TEST DEVICE 28SOIC
標準包裝: 1,000
系列: 74ABT
邏輯類型: 掃描測試設備,帶寄存總線收發(fā)器
電源電壓: 4.5 V ~ 5.5 V
位數(shù): 8
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 28-SOIC(0.295",7.50mm 寬)
供應商設備封裝: 28-SOIC
包裝: 帶卷 (TR)
SN54ABT8952, SN74ABT8952
SCAN TEST DEVICES WITH
OCTAL REGISTERED BUS TRANSCEIVERS
SCBS121D – AUGUST 1992 – REVISED JULY 1996
19
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
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T
est-Logic-Reset
Run-T
est/Idle
Select-DR-Scan
Select-IR-Scan
Capture-IR
Shift-IR
Exit1-IR
Update-IR
Select-DR-Scan
Capture-DR
Shift-DR
Exit1-DR
Update-DR
Select-DR-Scan
Select-IR-Scan
T
est-Logic-Reset
TCK
TMS
TDI
TDO
TAP
Controller
State
3-State (TDO) or Don’t Care (TDI)
Figure 12. Timing Example
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC
–0.5 V to 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (except I/O ports) (see Note 1)
–0.5 V to 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (I/O ports) (see Note 1)
–0.5 V to 5.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the high state or power-off state, VO
–0.5 V to 5.5 V
. . . . . . . . . . . . . .
Current into any output in the low state, IO: SN54ABT8952
96 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN74ABT8952
128 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0)
–18 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0)
–50 mA
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Maximum power dissipation at TA = 55°C (in still air) (see Note 2): DL package
0.7 W
. . . . . . . . . . . . . . . . . . .
DW package
1.7 W
. . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg
–65
°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150
°C and a board trace length of 750 mils.
For more information, refer to the
Package Thermal Considerations application note in the ABT Advanced BiCMOS Technology Data
Book, literature number SCBD002.
recommended operating conditions (see Note 3)
SN54ABT8952
SN74ABT8952
UNIT
MIN
MAX
MIN
MAX
UNIT
VCC
Supply voltage
4.5
5.5
4.5
5.5
V
VIH
High-level input voltage
2
V
VIL
Low-level input voltage
0.8
V
VI
Input voltage
0
VCC
0
VCC
V
IOH
High-level output current
–24
–32
mA
IOL
Low-level output current
48
64
mA
t/v
Input transition rise or fall rate
10
ns/V
TA
Operating free-air temperature
–55
125
–40
85
°C
NOTE 3: Unused pins (input or I/O) must be held high or low to prevent them from floating.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
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