
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
5962-9308602Q3A
ACTIVE
LCCC
FK
28
1
TBD
POST-PLATE
N / A for Pkg Type
5962-9308602QKA
ACTIVE
CFP
W
24
1
TBD
A42
N / A for Pkg Type
5962-9308602QLA
ACTIVE
CDIP
JT
24
1
TBD
A42
N / A for Pkg Type
SN74ABT2952ADBLE
OBSOLETE
SSOP
DB
24
TBD
Call TI
SN74ABT2952ADBR
ACTIVE
SSOP
DB
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT2952ADBRE4
ACTIVE
SSOP
DB
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT2952ADBRG4
ACTIVE
SSOP
DB
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT2952ADW
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT2952ADWE4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT2952ADWG4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT2952ADWR
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT2952ADWRE4
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT2952ADWRG4
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT2952ANSR
ACTIVE
SO
NS
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT2952ANSRE4
ACTIVE
SO
NS
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT2952ANSRG4
ACTIVE
SO
NS
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT2952ANT
ACTIVE
PDIP
NT
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74ABT2952ANTE4
ACTIVE
PDIP
NT
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SNJ54ABT2952AFK
ACTIVE
LCCC
FK
28
1
TBD
POST-PLATE
N / A for Pkg Type
SNJ54ABT2952AJT
ACTIVE
CDIP
JT
24
1
TBD
A42
N / A for Pkg Type
SNJ54ABT2952AW
ACTIVE
CFP
W
24
1
TBD
A42
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
Addendum-Page 1