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參數(shù)資料
| 型號： | SN54F521J |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 算術邏輯單元 |
| 英文描述： | F/FAST SERIES, 8-BIT IDENTITY COMPARATOR, INVERTED OUTPUT, CDIP20 |
| 封裝： | 0.300 INCH, CERAMIC, DIP-20 |
| 文件頁數(shù)： | 12/16頁 |
| 文件大?。?/td> | 669K |
| 代理商： | SN54F521J |
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
5962-9759101Q2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
5962-9759101QRA
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
5962-9759101QSA
ACTIVE
CFP
W
20
1
TBD
Call TI
N / A for Pkg Type
JM38510/34701B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
JM38510/34701BRA
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
JM38510/34701BSA
ACTIVE
CFP
W
20
1
TBD
Call TI
N / A for Pkg Type
SN54F521J
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
SN74F521DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F521DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F521DWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F521DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F521DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F521DWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F521N
ACTIVE
PDIP
N
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74F521N3
OBSOLETE
PDIP
N
20
TBD
Call TI
SN74F521NE4
ACTIVE
PDIP
N
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74F521NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F521NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F521NSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SNJ54F521FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
SNJ54F521J
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
SNJ54F521W
ACTIVE
CFP
W
20
1
TBD
Call TI
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
Addendum-Page 1
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