
21
SENSITIVE
SURFACE
0.45
LEAD
20
3
.8
±
0
.2
9.1 ± 0.2
8.1 ± 0.1
WINDOW
5.9 ± 0.1
5.08 ± 0.2
SMP550G-EK
Prelim. 1/98
Semelab plc. Telephone (01455) 556565. Telex: 341927. Fax (01455) 552612.
MECHANICAL DATA
Dimensions in mm.
P.I.N. PHOTODIODE
DESCRIPTION
The SMP550G-EK is a Silicon P.I.N. photodiode
incorporated in a hermetic metal can package. The
package window has greater ultra-violet light transmission,
thus extending the useful spectral range of the device. The
electrical terminations are via two leads of diameter 0.018"
on pitch of 0.2". The cathode of the photodiode is
electrically connected to the package.
The larger photodiode active area provides greater
sensitivity than the SMP400 range of devices, with a
corresponding reduction in speed. The photodiode
structure has been optimised for high sensitivity, light
measurement applications across the infra-red to ultra-
violet spectrum. Inclusion of a suitable optical filter into the
package can produce a device that responds only to ultra-
violet light. The metal can and optional screening mesh
ensure a rugged device with a high degree of immunity to
radiated electrical interference.
TO-39 Package
Operating temperature range
Storage temperature range
Temperature coefficient of responsively
Temperature coefficient of dark current
Reverse breakdown voltage
-40°C to +70°C
-45°C to +80°C
0.35% per °C
x2 per 8°C rise
60V
ABSOLUTE MAXIMUM RATINGS (Tcase = 25°C unless otherwise stated)
FEATURES
EXCELLENT LINEARITY
LOW NOISE
WIDEST SPECTRAL RESPONSE
ENHANCED UV SENSITIVITY
LOW LEAKAGE CURRENT
LOW CAPACITANCE
INTEGRAL OPTICAL FILTER OPTION note 1
TO39 HERMETIC METAL CAN PACKAGE
EMI SCREENING MESH AVAILABLE
Note 1 Contact Semelab Plc for filter options
Pin 1 – Anode
Pin 2 – Cathode & Case