參數(shù)資料
型號(hào): SMP1353-050
廠商: SKYWORKS SOLUTIONS INC
元件分類: PIN二極管
英文描述: 100 V, SILICON, PIN DIODE
封裝: CSP-4
文件頁(yè)數(shù): 4/4頁(yè)
文件大?。?/td> 615K
代理商: SMP1353-050
4
Skyworks Solutions, Inc. [781] 376-3000
Fax [781] 376-3100 Email sales@skyworksinc.com www.skyworksinc.com
Specifications subject to change without notice. 3/03A
Switching Chip Scale PIN Diodes
SMP1340-050, SMP1353-050
Finished Product
Once reflowed, the component should be fairly centered
on the land pattern. Solder should wet evenly to CSP leads
and the component should not display excessive tilt or skew.
A solvent flux clean can be safely employed if desired.
Temp
(C)
Time (s)
Lead Free Profile
0
30
60
90
120
150
180
210
240
270
300
0
50
100
150
200
250
300
Temp
(C)
Time (s)
Eutectic Tin-Lead Profile
0
50
100
150
200
250
300
0
30
60
90
120
150
180
210
240
Solder Reflow
Solder reflow is best suited to convection or IR reflow
systems, though convection reflow will always give more
rapid and uniform thermal transfer. The CSP can be
successfully
reflowed
in
either
air
or
nitrogen
atmospheres.
The
solder
paste
manufacturer’s
recommended reflow profile should be adhered to and
care should be taken to ensure that the profile is adjusted
for variability in thermal mass amongst components.
Attached are generic profiles for eutectic tin-lead solder
and a typical lead-free solder.
These should only be used as a guideline, with the paste
manufacturers recommended profile taking precedence.
A standard solvent flux clean can be safely employed to
remove flux residue from the device edges.
相關(guān)PDF資料
PDF描述
SMP1340-050 50 V, SILICON, PIN DIODE
SMP1371-087LF SILICON, PIN DIODE
SMP6LC05-2P-T7 3600 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE
SMP6LC6.5-2P-T7 3600 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE
SMP6LC05-2P-LF-T7 3600 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE
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