
SMM150
Preliminary Information
Summit Microelectronics, Inc
2075 2.6 05/13/05
22
PART MARKING – QFN PACKAGE
SUMMIT
SMM150N
L AYYWW
Pin 1
Annn
Summit
Part Number
Date Code (YYWW)
Part Number suffix
(Contains Customer specific
ordering requirements)
Lot tracking code (Summit use)
Drawing not
to scale
SS
Status Tracking Code
(Blank, MS, ES, 01, 02,...)
(Summit Use)
Product Tracking Code (Summit use)
100% Sn, RoHS compliant, Green
ORDERING INFORMATION
NOTICE
NOTE 1 - This is a
Preliminary Information
data sheet that describes a Summit product currently in pre-production with limited characterization.
SUMMIT Microelectronics, Inc. reserves the right to make changes to the products contained in this publication in order to improve design,
performance or reliability. SUMMIT Microelectronics, Inc. assumes no responsibility for the use of any circuits described herein, conveys no license
under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained
herein reflect representative operating parameters, and may vary depending upon a user’s specific application. While the information in this
publication has been carefully checked, SUMMIT Microelectronics, Inc. shall not be liable for any damages arising as a result of any error or
omission.
SUMMIT Microelectronics, Inc. does not recommend the use of any of its products in life support or aviation applications where the failure or
malfunction of the product can reasonably be expected to cause any failure of either system or to significantly affect their safety or effectiveness.
Products are not authorized for use in such applications unless SUMMIT Microelectronics, Inc. receives written assurances, to its satisfaction, that:
(a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; and (c) potential liability of SUMMIT Microelectronics, Inc.
is adequately protected under the circumstances.
Revision 2.6 - This document supersedes all previous versions. Please check the Summit Microelectronics, Inc. web site at
www.summitmicro.com
for data sheet updates.
Copyright 2005 SUMMIT MICROELECTRONICS, Inc.
PROGRAMMABLE ANALOG FOR A DIGITAL WORLD
I2C is a trademark of Philips Corporation,
Ultra
CSP
TM
is a registered name of FlipChip International, LLC.
SMM150
N
nnn
N=28 Pad QFN
E=20 Ball
Ultra
CSP
TM
Part Number Suffix (see page 19)
Customer specific requirements are contained
in the suffix such as Hex code, Hex code
revision, etc.
Summit
Part
Number
C
Temp Range
C=Commercial
Blank=Industrial
V
is the Lead-Free Attribute for the CSP
(E Package),
L
is for the QFN (N package)
V
20 Ball
Ultra
CSP
TM
28 Pad QFN
S
X
Ball A1
Identifier
Date Code
Y = Single digit year
(4=2004, 5=2005, etc)
Drawing not
to scale
Summit Part Number
X is the sequential letter per wafer
(i.e. A for the first wafer, B for the second wafer,
C for the third wafer, etc.)
100% Sn, RoHS compliant,
Green