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參數(shù)資料
| 型號(hào)： | SML-522MUWT86 |
| 廠商： | Rohm Semiconductor |
| 文件頁(yè)數(shù)： | 8/10頁(yè) |
| 文件大小： | 582K |
| 描述： | LED 570NM/630NM GREEN/RED 0605 |
| 標(biāo)準(zhǔn)包裝： | 4,000 |
| 顏色： | 綠，紅 |
| Millicandela 等級(jí)： | 40mcd 綠，63mcd 紅 |
| 正向電壓： | 2.1V 綠，1.9V 紅 |
| 電流 - 測(cè)試： | 20mA |
| 波長(zhǎng) - 主： | 572nm，620nm |
| 透鏡類型： | 散射，白色 |
| 透鏡樣式/尺寸： | 矩形，帶平頂，1.3mm x 1.1mm |
| 封裝/外殼： | 0605（1613 公制） |
| 尺寸/尺寸： | 1.50mm L x 1.30mm W |
| 高度： | 0.60mm |
| 安裝類型： | 表面貼裝 |
| 包裝： | 帶卷 (TR) |
www.rohm.com
?2013 ROHM Co., Ltd. All rights reserved.
Data Sheet
SML-52 series
lAttention Points In Handlin
This product was developed as a surface mount LED especially suitable for soldering.
Please take care of following points when using this device.
1.DESIGNING OF PCB
As for a recommendable solder pattern, Please refer to Fig-1.
The size and direction of the pad pattern depend on the condition of the PCB.
Thorough design review is recommended before the final designing
his product of structured with rear/bottom electrode to be soldered.
The formation of solder fillet is not guaranteed due to its electrode shape.
.SOLDERING Sn-Cu Sn-A -Cu Sn-A -Bi-Cu
LED products do not contain reinforcement
materials such as glass fillers.
herefore thermal stress b solderin reatl
influence its reliability.
The temperature conditions for reflow soldering
should therefore be set up according to the
characteristic of this product. (See Fig-2)
Number of reflow process shall be max 2 times
and these processes shall be performed in a row.
Cooling process to normal temperature shall be required
between first and second soldering process.
.HANDLING AFTER MOUNTING
As shown right drawing, in case outside force of around
1kg is given to the device, stress is concentrated to the
jointed part between mold resin and substrate.
Therefore there is a possibility to breat the device or PCB.
Careful handing is needed as ROHM cannot guarantee the falling
of the device by outside force after mounting.
.WASHING
Please note the following points when washing is required after soldering.
4-1) WASHING SOLVENT
sopropyl alcohol or other alcohol solvent is recommendable.
4-2) TEMPERATURE
Below 30篊, immersion time ; within 3 minutes.
4-3) ULTRA SONIC WASHING
Below 15/1 litter of solvent tub.
4-4) COOLING
Below 100篊 within 3 minutes.
.EROSION GAS
tilization in erosion gas atmosphere may degenerate the plating surface which might cause deterioration of
solder strength, optical characteristics, or functions.
Please take precautions against occurrence of gas from the surrounding parts on the occasion of custody,
and also after mounted on circuit board.
Min.1 min Max. 40sec
Max.250篊, Within 10sec
140 to 180篊
230 to 260篊
(Fig-1)
(Fig-2)
0.6mm
2.45mm
Outside Force
PCB
Mold
Substrate
Soldering part
Emitting Direction
8/9
2013.09 - Rev.D
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