參數(shù)資料
型號(hào)： SMBG160P
廠商： MICRO COMMERCIAL COMPONENTS
元件分類： 參考電壓二極管
英文描述： 600 W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-215AA
封裝： SMBG, 2 PIN
文件頁數(shù)： 1/6頁
文件大?。?/td> 1565K
代理商： SMBG160P
Features
l For surface mount applications (flat handing surface for accurate
Placement)
l Available as a unidirectional or bi-directional device
l Fast response time: typical less than 1.0ps from 0 volts to
VBR minimum
l Suppresses transients up to 600W @1.0ms including ESD per
Human body model test above 16kv (class 3)
l Available on tape and reel
Mechanical Data
l
CASE: JEDEC DO-215AA
l
Terminals: solderable per MIL-STD-750, Method 2026
l
Polarity: is indicated by cathode band. Bidirectional devices
Have no polarity band
l
Maximum soldering temperature: 260
oC for 10 seconds
Maximum Ratings @ 25oC Unless Otherwise Specified
Peak Pulse Current on
10/1000us waveform
IPP
See Table 1 Note: 1
Peak Pulse Power
Dissipation
PPP
600W
Note: 1,
5
Peak Forward Surge
Current
IFSM)
40A
Note: 3
Steady State Power
Dissipation
P(AV)
1.0W
Note: 2,
4
Operation And Storage
Temperature Range
TJ, TSTG
-55
oC to
+150
oC
Thermal Resistance
R
25
oC/W
NOTES:
1.
Non-repetitive current pulse, per Fig.2 and derated above
TA=25
oC per Fig.1.
2.
Mounted on 4.0mm
2 copper pads to each terminal.
3.
8.3ms, single half sine wave duty cycle=4 pulses per. Minute
maximum. Peak forward voltage at 40A is 3.5 volts( unipolar
only)
4.
Lead temperature at 75
oC=T
L
5.
Peak pulse current waveform is 10/1000us, with maximum duty
Cycle of 0.01%.
SMBG5.0(A)
THRU
SMBG170(A)
Transient
Voltage Suppressor
5.0 to 170 Volts
600 Watt
www.mccsemi.com
DO-215AA
(SMBG) (Lead Frame)
0.070”
0.175"
0.095”
SUGGESTED SOLDER
PAD LAYOUT
G
H
J
E
F
A
B
D
C
Cathode Band
DIMENSIONS
INCHES
MM
DIM
MIN
MAX
MIN
MAX
NOTE
A
.075
.095
1.91
2.41
B
.077
.083
1.96
2.10
C
.004
.008
.10
.20
D
---
.02
---
.51
E
.015
.03
.38
.76
F
.065
.084
1.65
2.13
G
.235
.255
5.97
6.48
H
.160
.185
4.06
4.70
J
.130
.155
3.30
3.94
omponents
20736 Marilla Street Chatsworth
!"#
$% !"#
MCC
Revision: 3
2003/04/30
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