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參數(shù)資料
| 型號： | SM05T1 |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | Transient Voltage Suppressor Diode Array |
| 中文描述： | 300 W, UNIDIRECTIONAL, 2 ELEMENT, SILICON, TVS DIODE, TO-236AB |
| 封裝： | PLASTIC, CASE 318-08, TO-236, 3 PIN |
| 文件頁數(shù)： | 5/6頁 |
| 文件大?。?/td> | 56K |
| 代理商： | SM05T1 |
SM05T1 Series
http://onsemi.com
5
INFORMATION FOR USING THE SOT-23 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the
total design. The footprint for the semiconductor packages
must be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
SOT-23
mm
inches
0.037
0.95
0.037
0.95
0.079
2.0
0.035
0.9
0.031
0.8
SOT-23 POWER DISSIPATION
The power dissipation of the SOT-23 is a function of the
drain pad size. This can vary from the minimum pad size
for soldering to a pad size given for maximum power
dissipation. Power dissipation for a surface mount device is
determined by T
J(max)
, the maximum rated junction
temperature of the die, R
θ
JA
, the thermal resistance from
the device junction to ambient, and the operating
temperature, T
A
. Using the values provided on the data
sheet for the SOT-23 package, P
D
can be calculated as
follows:
T
J(max)
- T
A
P
D
=
R
θ
JA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values
into the equation for an ambient temperature T
A
of 25
°
C,
one can calculate the power dissipation of the device which
in this case is 225 milliwatts.
P
D
=150
°
C - 25
°
C
556
°
C/W
The 556
°
C/W for the SOT-23 package assumes the use
of the recommended footprint on a glass epoxy printed
circuit board to achieve a power dissipation of 225
milliwatts. There are other alternatives to achieving higher
power dissipation from the SOT-23 package. Another
alternative would be to use a ceramic substrate or an
aluminum core board such as Thermal Clad
. Using a
board material such as Thermal Clad, an aluminum core
board, the power dissipation can be doubled using the same
footprint.
= 225 milliwatts
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
Always preheat the device.
The delta temperature between the preheat and
soldering should be 100
°
C or less.*
When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference shall be a maximum of 10
°
C.
The soldering temperature and time shall not exceed
260
°
C for more than 10 seconds.
When shifting from preheating to soldering, the
maximum temperature gradient shall be 5
°
C or less.
After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
Mechanical stress or shock should not be applied
during cooling.
* * Soldering a device without preheating can cause
excessive thermal shock and stress which can result in
damage to the device.
相關(guān)PDF資料 |
PDF描述 |
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| SM12T1 | Transient Voltage Suppressor Diode Array |
| SM10LZ47 | RESISTOR: 49.9 OHM, 1/10W, 1%, PACKAGE 0805 |
| SM110G0 | FUSIBLE ALLOY THERMAL SENSITIVE TYPE, 0.5 AMPERES 250 Va.c. and 3 and 5 AMPERES 50 Vd.c. Rated Current |
| SM134G0 | FUSIBLE ALLOY THERMAL SENSITIVE TYPE, 0.5 AMPERES 250 Va.c. and 3 and 5 AMPERES 50 Vd.c. Rated Current |
| SM130G0 | FUSIBLE ALLOY THERMAL SENSITIVE TYPE, 0.5 AMPERES 250 Va.c. and 3 and 5 AMPERES 50 Vd.c. Rated Current |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SM05T1_11 | 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:Transient Voltage Suppressor Diode Array |
| SM05T1G | 功能描述:TVS二極管陣列 ZEN MONOLITHIC DUAL RoHS:否 制造商:Littelfuse 極性: 通道:4 Channels 擊穿電壓: 鉗位電壓:11.5 V 工作電壓:2.5 V 峰值浪涌電流:20 A 安裝風(fēng)格:SMD/SMT 端接類型:SMD/SMT 系列: 最小工作溫度:- 40 C 最大工作溫度:+ 85 C |
| SM05T1G | 制造商:ON Semiconductor 功能描述:TVS DIODE ARRAY 300W 5V SOT-23 |
| SM05T1G-CUT TAPE | 制造商:ON 功能描述:SM05T1 Series 7.3 V 300 W Transient Voltage Suppressor Diode Array - SOT-23-3 |
| SM05TC | 制造商:Semtech Corporation 功能描述: |
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