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參數(shù)資料
| 型號： | SL2ICS5101EW/V7,00 |
| 廠商： | NXP Semiconductors |
| 文件頁數(shù)： | 25/28頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC I-CODE SLI SMART LABEL DIE |
| 標準包裝： | 28,477 |
| 系列： | * |
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136430
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 3.0 — 14 March 2007
6 of 28
NXP Semiconductors
SL2 ICS50/SL2 ICS51
ICODE SLI-L/ICODE SLI-L HC
PUBLIC
7. Functional description
7.1 Block description
The label requires no internal power supply. Its contactless interface generates the power
supply and the system clock via the resonant circuitry by inductive coupling to the
interrogator. The interface also demodulates data that are transmitted from the
interrogator to the ICODE Label, and modulates the electromagnetic field for data
transmission from the ICODE Label to the interrogator.
Data are stored in a non-volatile memory (EEPROM). The EEPROM has a memory
capacity of 512 bit and is organized in 16 blocks consisting of 4 bytes each (1 block =
32 bits). The higher 8 blocks contain user data and the lowest 8 blocks contain the unique
identifier, the write access conditions and special data like AFI and DSFID.
7.2 Memory organization
The 512 bit EEPROM memory is divided into 16 blocks. A block is the smallest access
unit. Each block consists of 4 bytes (1 block = 32 bits). 4 blocks are summed up to 1 page.
Bit 0 in each byte represents the least significant bit (LSB) and bit 7 the most significant bit
(MSB), respectively.
The Memory is divided into 2 parts:
Configuration Area
– Within this part of the memory all required information are stored like UID, Write
protection, Passwords and so on. Direct access to this memory area is not
possible.
User Memory
– Within this area the user data are stored. Direct Read/write access to this part of
the memory is possible depending on the related write protection conditions.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SL2ICS5301EW/V7,00 | 功能描述:數(shù)據(jù)轉(zhuǎn)換系統(tǒng) Wafer addendum RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換速率:0.001 MSPs 分辨率:24 bit 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SL2ICS5301EW/V7L,005 | 制造商:NXP Semiconductors 功能描述: |
| SL2ICS5311EW/V7,00 | 功能描述:數(shù)據(jù)轉(zhuǎn)換系統(tǒng) Bumped Wafer RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換速率:0.001 MSPs 分辨率:24 bit 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SL2ICS5311EW/V7,005 | 制造商:NXP Semiconductors 功能描述: |
| SL2ICS5401EW/V7,00 | 功能描述:數(shù)據(jù)轉(zhuǎn)換系統(tǒng) sawn wafer 150um on film frame carrie RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換速率:0.001 MSPs 分辨率:24 bit 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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