參數(shù)資料
型號(hào): SL2ICS5001EW/V7,00
廠商: NXP Semiconductors
文件頁(yè)數(shù): 20/28頁(yè)
文件大?。?/td> 0K
描述: IC I-CODE SLI SMART LABEL DIE
標(biāo)準(zhǔn)包裝: 31,071
系列: *
NXP Semiconductors
SL2 ICS50/SL2 ICS51
ICODE SLI-L/ICODE SLI-L HC
NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 14 March 2007
Document identifier: 136430
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
PUBLIC
12. Tables
13. Figures
Fig 1.
Block diagram of TAG IC . . . . . . . . . . . . . . . . . . . .5
14. Contents
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參數(shù)描述
SL2ICS5101EW/V7,00 功能描述:數(shù)據(jù)轉(zhuǎn)換系統(tǒng) Dedicated Chip For Smart Lapel APPS RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換速率:0.001 MSPs 分辨率:24 bit 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
SL2ICS5101EW/V7,005 制造商:NXP Semiconductors 功能描述:
SL2ICS5301EW/V7,00 功能描述:數(shù)據(jù)轉(zhuǎn)換系統(tǒng) Wafer addendum RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換速率:0.001 MSPs 分辨率:24 bit 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
SL2ICS5301EW/V7L,005 制造商:NXP Semiconductors 功能描述:
SL2ICS5311EW/V7,00 功能描述:數(shù)據(jù)轉(zhuǎn)換系統(tǒng) Bumped Wafer RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換速率:0.001 MSPs 分辨率:24 bit 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel