
Rev 2.0, May 28, 2008
Page 16 of 18
SL23EP08
Package Outline and Package Dimensions
16-Lead TSSOP (4.4-mm)
0.190(0.007)
0.300(0.012)
0.090(0.003)
0.200(0.008)
8
9
6.250(0.246)
6.500(0.256)
4.300(0.169)
4.500(0.177)
4.900(0.193)
5.100(0.200)
0.800(0.031)
1.050(0.041)
0.050(0.002)
0.150(0.006)
1.200(0.047) MAX
0.076(0.003)
0 to 8°
0.500(0.020)
0.750(0.030)
0.250(0.010)
BSC
Gauge
Plane
Dimensions are in milimeters (inches)
Top line: (MIN) and Bottom line: (Max)
Pin-1 ID
Seating Plane
1
16
0.650(0.025)
BSC
Thermal Characteristics
Parameter
Symbol
Condition
Min
Typ
Max
Unit
θ JA
Still air
-
105
-
°C/W
θ JA
1m/s air flow
-
95
-
°C/W
Thermal Resistance
Junction to Ambient
θ JA
3m/s air flow
-
90
-
°C/W
Thermal Resistance
Junction to Case
θ JC
Independent of air flow
-
35
-
°C/W