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參數(shù)資料
| 型號(hào)： | SIP-1X29-014B-R |
| 元件分類： | 插座 |
| 英文描述： | SIP29, IC SOCKET |
| 文件頁(yè)數(shù)： | 1/1頁(yè) |
| 文件大?。?/td> | 0K |
| 代理商： | SIP-1X29-014B-R |
SIP = SIP
SIP050 = SIP Low Profile
SPF080 = SIP Press Fit
PPCSIP = Plastic Pin Carrier SIP
See Charts Below
Part Number
Product Line
X
Contact Part Number
Option
R = High Temperature
1 = Single
2 = Double
Row
Option
01 to 32
01 to 18 = Press Fit
Contacts
Per Row
Contact
Clip
Clip/Shell
Part Number
Number
Plating
041B
4 (30)
30 " Gold/200 " Tin
Plated Through Hole
.66 (.026)
± .08 (.003)
SIP
Fingers
Insertion Extraction
Clip 4 (30)
4175 g
90 g
Clip 4 (12)
4
350 g
150 g
Clip 3 (11)
380 g
40 g
Clip 3 (21)
345 g
20 g
Contact
Clip
Clip/Shell
Part Number
Number
Plating
157B
4 (12)
200 " Tin/200 " Tin
160B
4 (12)
30 " Gold/200 " Tin
Plated Through Hole
.91 (.036)
± .08 (.003)
SIP050
(Very Low Profile)
Contact
Clip
Clip/Shell
Part Number
Number
Plating
001B
4 (30)
30 " Gold/200 " Tin
002B
4 (30)
30 " Gold/10 " Gold
011B
4 (30)
10 " Gold/200 " Tin
014B
4 (30)
200 " Tin/200 " Tin
Plated Through Hole
.66 (.026)
± .08 (.003)
SIP
Contact
Clip
Clip/Shell
Part Number
Number
Plating
710C
3 (11)
30 " Gold/200 " Tin
Plated Through Hole
1.07 (.042)
± .08 (.003)
PPCSIP
[.41 (.016") Above PCB)
Contact
Clip
Clip/Shell
Part Number
Number
Plating
725C
3 (21)
30 " Gold/200 " Tin
726C
3 (21)
200 " Tin/200 " Tin
Plated Through Hole
.97 (.038)
± .08 (.003)
PPCSIP
[.79 (.031") Above PCB)
Press Fit (SPF080)
Contact
Clip
Clip/Shell
Part Number
Number
Plating
970E
4 (30)
30 " Gold/10 " Gold
Plated Through Hole
.99 (.038)
± .05 (.002)
Contact
Clip
Clip/Shell
Part Number
Number
Plating
998E
3 (21)
200 " Tin/200 " Tin
Plated Through Hole
1.02 (.040)
±.05 (.002)
Compliant Press Fit (SPF080)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| SIP-1X32-002B-R | SIP32, IC SOCKET |
| SIP050-1X09-160B-R | SIP9, IC SOCKET |
| SIP050-1X11-157B-R | SIP11, IC SOCKET |
| SIP-2X28-041B-R | DIP56, IC SOCKET |
| SIP-2X30-011B-R | DIP60, IC SOCKET |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SIP1X30-041B | 功能描述:IC 與器件插座 30P SIP SOCKET RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| SIP1X30-041BLF | 功能描述:IC 與器件插座 30P SIP SOCKET RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| SIP-1X3-011B | 制造商:FCI 功能描述: |
| SIP1X32-001B | 制造商:FCI 功能描述: |
| SIP-1X32-001BLF | 制造商:FCI 功能描述: |
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